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Z. Moser, P. Sebo, W. Gasior, P. Švec, J. Pstruś (2009)
Effect of indium on wettability of Sn-Ag-Cu solders. Experiment vs. modeling, Part ICalphad-computer Coupling of Phase Diagrams and Thermochemistry, 33
T. Matsumoto, K. Nogi (2008)
Wetting in Soldering and MicroelectronicsAnnual Review of Materials Research, 38
I. Artaki, A. Jackson, P. Vianco (1994)
Evaluation of Lead- Free Solder Joints in Electronic AssembliesJournal of Electronic Materials, 23
Z. Moser, W. Gasior, J. Pstruś, I. Ohnuma, K. Ishida (2006)
Influence of Sb additions on surface tension and density of Sn–Sb, Sn–Ag–Sb andSn–Ag–Cu–Sb alloys: Experiment vs. modelingInternational Journal of Materials Research, 97
A. Sharif, Y. Chan (2005)
Effect of indium addition in Sn-rich solder on the dissolution of Cu metallizationJournal of Alloys and Compounds, 390
Z. Moser, W. Gasior, J. Pstruś, S. Ishihara, Xingjun Liu, I. Ohnuma, R. Kainuma, K. Ishida (2004)
Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary systemMaterials Transactions, 45
Z. Moser, W. Gasior, J. Pstruś, I. Kaban, W. Hoyer (2009)
Thermophysical Properties of Liquid In–Sn AlloysInternational Journal of Thermophysics, 30
W. Gasior, Z. Moser, J. Pstruś, K. Bukat, J. Sitek, R. Kisiel (2004)
(Sn-Ag)eut+Cu soldering materials, part I: Wettability studiesJournal of Phase Equilibria and Diffusion, 25
X. Liu, Y. Inohana, Y. Takaku, I. Ohnuma, R. Kainuma, K. Ishida, Z. Moser, W. Gasior, J. Pstruś (2002)
Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In systemJournal of Electronic Materials, 31
I. Ohnuma, K. Ishida, Z. Moser, S. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek (2006)
Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additionsJournal of Phase Equilibria and Diffusion, 27
P. Štefánik, S. Republic (2005)
EFFECT OF In ADDITION ON Sn-Ag SOLDER, ITS WETTING AND SHEAR STRENGTH OF COPPER JOINTS
E. Lopez, P. Vianco, J. Rejent (2005)
Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated kovar substratesJournal of Electronic Materials, 34
A. Yu, Chang-Woo Lee, Mok-Soon Kim, Jong-Hyun Lee (2007)
The effect of the addition of in on the reaction and mechanical properties of Sn−1.0Ag−0.5Cu solder alloyMetals and Materials International, 13
Jennie Hwang (2004)
Implementing Lead-Free Electronics
R. Kisiel, K. Bukat, J. Sitek, W. Gąsior, Z. Moser, J. Pstruś
SnAgCuBi and SNAgCiBiSb solder joint properties investigations
Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida, I. Ohnuma (2006)
Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb AdditionsJournal of Phase Equilibria and Diffusion, 28
T. Takemoto, M. Miyazaki (2001)
Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance TestMaterials Transactions, 42
P. Fima, W. Gasior, A. Sypień, Z. Moser (2010)
Wetting of Cu by Bi–Ag based alloys with Sn and Zn additionsJournal of Materials Science, 45
D. Mari
Global trends in electronic manufacturing
P. Sebo, Z. Moser, P. Švec, D. Janickovic, E. Dobročka, W. Gasior, J. Pstruś (2009)
Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrateJournal of Alloys and Compounds, 480
Kaihwa Chew, J. Pang (2005)
Impact of drop-in lead free solders on microelectronics packaging2005 7th Electronic Packaging Technology Conference, 2
Z. Moser, P. Sebo, W. Gąsior, P. Svec, J. Pstruś
Effect of indium on wettability of Sn‐Ag‐Cu solders
K. Bukat, J. Sitek, R. Kisiel, Z. Moser, W. Gasior, M. Kościelski, J. Pstruś (2008)
Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVASoldering & Surface Mount Technology, 20
Z. Moser, W. Gasior, J. Pstruś, W. Zakulski, I. Ohnuma, X. Liu, Y. Inohana, K. Ishida (2001)
Studies of the Ag-In phase diagram and surface tension measurementsJournal of Electronic Materials, 30
Z. Moser, W. Gasior, J. Pstruś, S. Księżarek (2002)
Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additionsJournal of Electronic Materials, 31
W. Gasior, Z. Moser, J. Pstruś (2004)
Measurements of the surface tension and density of TIN based Sn-Ag-Cu-Sb liquid alloysArchives of Metallurgy and Materials
J. Sopoušek, M. Palcut, E. Hodúlová, J. Janovec (2010)
Thermal Analysis of the Sn-Ag-Cu-In Solder AlloyJournal of Electronic Materials, 39
M. Miyazaki, M. Mitutani, T. Takemoto, A. Matsunawa
Conditions for the measurement of the surface tension of solders with a wetting balance tester
R. Novakovic, E. Ricci, D. Giuranno, A. Passerone (2005)
Surface and transport properties of Ag-Cu liquid alloysSurface Science, 599
K. Martorano, M. Martorano, S. Brandi (2009)
Optimal conditions for the wetting balance testJournal of Materials Processing Technology, 209
J. Pstruś
Physicochemical properties of new solder alloys on example of the Sn‐Zn‐In system
Purpose – The purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in the presence of a flux. The main goal was to find correlations between the results of the wetting balance (WB) and the sessile drop (SD) method, in relation to the contact angles. Design/methodology/approach – The WB method was applied for the wetting measurements, at 250°C, in an air atmosphere and in the presence of a flux. The SD measurements were conducted at the same temperature, in the presence of the same flux, but in an Ar atmosphere, while the maximum bubble pressure (MBP) and dilatometric measurements were conducted in an Ar+H 2 atmosphere. The density data from the dilatometric method were used for the determination of the surface tension by means of MBP, and the WB method was used to determine the surface and interfacial tension. Next, the surface tension data from these two methods were compared. The WB data were used to calculate the contact angles and the obtained indirect data were compared with the results of the direct SD measurements of the contact angle. Findings – A higher In content in the alloy resulted in a lower contact angle on the copper, and the WB results agreed well with the results of the SD experiments. It was confirmed that, in liquid In‐Sn and the alloys containing In and Sn (Ag‐In‐Sn, Sn‐Ag‐Cu‐In, Sn‐Zn‐In), the improvement of the wettability was indicated only by the increase of the contact angle with the increasing In content. Research limitations/implications – Further studies are necessary for the confirmation of practical application, but they should be directed to the soldering of high indium alloys on printed circuit boards, with different finishes and qualities of the solder joint performance. Practical implications – Taking into account the contact angle data from the WB and SD methods, the best results of the SAC‐In alloy on copper were obtained for the alloy of the highest In content. It was found that the contact angles from SD after 4 s were higher (non‐equilibrium conditions) than the values calculated from WB after 3 s. In contrast, the contact angles from SD after 10 min (equilibrium conditions) were lower than those from WB after 3 s. The comparison suggests that the contact angles from WB are situated within the data from SD, showing the same lowering tendency with the increasing content of In, and they may be well accepted for practical purposes. On the other hand, the sample of the solder in the SD method, after a prolonged time – in order to get the equilibrium contact angle – may be used to study the interfacial phenomena with the Cu substrate. The differential thermal analysis results indicate that the melting temperature decreases with increasing tin concentration. Taking into account the results of this study and the available literature data, alloys containing 8‐10 wt% of In can be recommended for practical application. Originality/value – The WB and SD methods were used for the contact angle determination of a wide range of solder compositions, in the same temperature and flux conditions. Also, the surface tensions for these alloys were determined with the use of two independent methods: the MBP and the WB methods. The results obtained made it possible to draw conclusions regarding the correlation between the output of different methods and the conditions in which a comparison of the results can be made. It is supposed that these observations apply to many other alloy systems.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Feb 8, 2011
Keywords: Solders; Tin; Silver; Copper; Chemical elements and inorganic compounds
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