Access the full text.
Sign up today, get DeepDyve free for 14 days.
References for this paper are not available at this time. We will be adding them shortly, thank you for your patience.
Military and commercial hybrids, using high speed integrated circuits with increased inputoutput density, require low cost, high reliability thick film circuits providing high density, multilayered interconnections with controllable electrical and mechanical characteristics. To meet these criteria it was necessary to adapt the silk screen printing process, including design, materials and reproduction processes, to cater for thick film, that is able to reproduce extremely fine lines without sacrificing the edge definition of the circuit layout. Printing screens were developed to deposit gold and silver pastes with linespace widths of 50 microns 0.002 in. on bare ceramic and 100 microns 0.004 in. on dielectric layers. Interconnection between layers was achieved with 150 micron 0.006 in. dielectric via openings with corresponding viafill conductive connections gold or silver. The development of the photoimage onto the emulsion of the screen was deemed to be the most important single step in determining the final print definition of the circuit's design. The main body of this work was concentrated on this approach. The selection of the screens, emulsion system, UV exposure and development processes are also discussed. A capability circuit CQC was produced, consisting of five metal layers with linespaces of 100 microns connected on each side of the ceramic by front to back lasered throughhole connections of 125 microns 0.005 in. and layer interconnections through 150 micron 0.006 in. dielectric vias. This capability circuit is classed as an Electronic Component of Assessed Quality by Capability Approval in accordance with BS 63200.
Microelectronics International – Emerald Publishing
Published: Jan 1, 1994
Read and print from thousands of top scholarly journals.
Already have an account? Log in
Bookmark this article. You can see your Bookmarks on your DeepDyve Library.
To save an article, log in first, or sign up for a DeepDyve account if you don’t already have one.
Copy and paste the desired citation format or use the link below to download a file formatted for EndNote
Access the full text.
Sign up today, get DeepDyve free for 14 days.
All DeepDyve websites use cookies to improve your online experience. They were placed on your computer when you launched this website. You can change your cookie settings through your browser.