J. Hoffmann, Shipley, Germany Recycling von Natriumpersulfat—eine neue technisch-wirtschaftlich PCI F News interessant Alternative Dr B. Hartmann, Höllmüller Maschinenbau, Germany Heutige Möglichkeiten zur wirtschaftlichen Aufbereitung von Leiterplattenabfällen sowie zur Entsorgung von Elektronikschrott ICT TRAINING GRANT Prof Dr A. Jugel, Fuba Leiterplattewerk, Germany Sind die heutigen Qualitätsanforderungen überzogen? The Council of the ICT has recently made a grant to a member in respect H. Kuckelkorn, Fuba Hans Kolbe, Germany of its training courses following the introduction of the scheme earlier in the year. Schlußwort: Dr G. H. Beyer The recipient was Christine Jones who works for ISM, the laminate manufacturer based at Colnbrook. Christine attended the two weeks 'Comprehensive Course on Printed Circuit Technology' run by the PC1F/ICT held at the External Studies Department of Oxford University IEPS in October and to quote her own observation 'found it very rewarding in that it has given me an excellent overview of the entire printed circuit manufacturing process'. The grant scheme, run by the ICT, will continue into 1992 and 1992 IEPS CONFERENCE applications for training grants will be considered from PCIF individual members or PCIF members of corporate companies for future courses when Dates: 28-30 September 1992 they are announced. Venue: Austin Stouffer Hotel, Austin, Texas Paul Zarlingo, Programme Chairman for the 1992 International Electronics Packaging Conference, has announced the session schedule for EIPC the event. Plans are under way for four technology forums: Electronic Packaging Marketing Trends; Multichip Modules; Co-Fired Ceramic Technologies and Printed Wiring Boards. These four sessions are designed to afford the EIPC MAJOR FUNCTIONS—1992 audience an opportunity to question the panelists and make further comments. Fifteen technical sessions cover high technology areas including: Date Place Language Multichip Application; Chip-on-Board; Developments in Packaging Materials; Thermal Management I & II; Ceramic Packaging Technology; German 17 Feb Essen Innovations in the PCB Advances in Interconnect Technology; Electrical Design for Systems Industry Packaging; Chip Interconnection Techniques; Advanced Electronic Italian 5 May Bergamo PCBs in the OEM Future Interconnects; Thermal Stress Simulation; Current Multichip Issues; Projects Electronic Packaging for Surface Mount; Developments in Printed Wiring English 10-1 2 June Brussels Joint Conference with Boards and Optoelectronic Packaging and Interconnects. IPG/PCI F The programme is the only conference designed to address all the English 28-2 9 Sept Minsk Standards for PCB electronic packaging trends from device to systems. Now in its eleventh Manufacturing and Quality year, it draws speakers and attendees from Europe and Asia along with Management the North American audience. An eighty booth exhibit accompanies the English conference and will display the latest in electronic packaging materials and Oct Zurich BPA Marketing Seminar processes. Two vendor sessions will afford the exhibitor an opportunity (Members only) to present the latest developments of their products. English/German Dec Zurich Winter Conference (Annual Meeting) French/Italian For further details please contact EIPC, Via Maraini 17, CH-6900 Lugano, Switzerland. Telephone: 41 91 5481 44. Fax: 41 91 549 432. IPC TECHNISCHE INNOVATIONEN IN DER LEITERPLATTENFERTIGUNG DESIGN STANDARD FOR RIGID PRINTED BOARDS AND RIGID PRINTED ASSEMBLIES Date: 17 February 1992 Venue: Essen Copies of IPC-D-275 are now available. IPC-D-275 'Design Standard for Rigid Printed Boards and Rigid Printed Assemblies', replaces IPC-D-319 Programme (in German) 'Design Standard for Rigid Single and Double-sided Printed Boards', and Leitung: Dr G. H. Beyer, Fuba Hans Kolbe & Co., Germany IPC-D-949 'Design Standard for Rigid Multilayer Printed Boards'. In addition, IPC-D-275 has been approved for use by the military. Begrüßung: Dr G. H. Beyer In addition to industry support, contributions were made by many staff Neue technologische Wege zur Innenlagen-Herstellung mittels Flüßigresisten experts from various government agencies and has been approved by the D. Kapp-Schwoerer, Ciba Geigy, Switzerland Department of Defense. As a result, the specifications in this standard can Wirtschaftliche Aspekte bei der Innenlagen-Fertigung-Fest- und be used for both commercial and military applications. Designers will now Flüßigtechnologie be able to consult one document for producibility considerations, rather H. Cichorek, Isola Werke, Germany than researching a number of different documents. Neue Automatisierungsmöglkhkeiten zur Erhöhung der Wirtschaftlichkeit Details are provided regarding performance classifications, printed board des Bohrprozeßes producibility levels and data covering 6 different types of rigid boards, B. Gerlach, Schmoll Maschinen, Germany including: single-sided, double-sided, multilayers without blind or buried Hat die Trockenfilm-Lötstopmaske eine Zukunft? vias, multilayers with blind and/or buried vias, multilayer metal-core boards J. Anschütz, Morton International, Germany without blind or buried vias, and multilayer metal-core boards with blind Aktuelle Ergebnisse beim praktischen Einsatz von dünnen Zinnschichten and/or buried vias. Dr K. H. Ognibeni, Cimatec, Germany Copies of the new standard can be obtained by contacting IPC at 7380 Neue Anwendungsmöglichkeiten für dünne, chemisch abgeschiedene N. Lincoln Ave, Lincolnwood, IL 60046-1705. The cost: $20.00 to members, Bleizinn-Schichten $30.00 to non-members.
Circuit World – Emerald Publishing
Published: Jan 1, 1992
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