International association news
Shackleford, R.A.
1991-02-01 00:00:00
The programme will cover various aspects of high technology joining processes ranging from soldering and brazing to diffusion and adhesive bonding. The papers presented will cover the latest developments in production techniques, methods of enhancing quality, joint inspection, new or improved materials, designproperties of joints and longterm reliability.
http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.pngSoldering & Surface Mount TechnologyEmerald Publishinghttp://www.deepdyve.com/lp/emerald-publishing/international-association-news-ckqQvTUeac
The programme will cover various aspects of high technology joining processes ranging from soldering and brazing to diffusion and adhesive bonding. The papers presented will cover the latest developments in production techniques, methods of enhancing quality, joint inspection, new or improved materials, designproperties of joints and longterm reliability.
Journal
Soldering & Surface Mount Technology
– Emerald Publishing
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