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Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders

Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying element.Design/methodology/approachA composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic solders and Ni particles, reacting this composite solder at 250°C–280°C was studied.FindingsExperimental results showed that only the IMC Ni3Sn4 was present as a reaction product. Using the diffusion-controlled reaction mechanism, a kinetic equation quantifying both Sn concentration and alloying element effects was derived and verified by comparing the kinetic data obtained using four different solders with different concentrations of Sn and the alloying elements.Originality/valueThe similarity between the activation energies of these four solders confirms that the diffusion of Sn atoms through the IMC is the rate-controlling step. Besides, the kinetic values are independent of the geometry of Ni, whether spherical particle or flat substrate. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders

Lin, Chung-Yung
Soldering & Surface Mount Technology , Volume 33 (4): 6 – Jul 12, 2021
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Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0954-0911
eISSN
0954-0911
DOI
10.1108/ssmt-10-2020-0046
Publisher site
See Article on Publisher Site

Abstract

This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying element.Design/methodology/approachA composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic solders and Ni particles, reacting this composite solder at 250°C–280°C was studied.FindingsExperimental results showed that only the IMC Ni3Sn4 was present as a reaction product. Using the diffusion-controlled reaction mechanism, a kinetic equation quantifying both Sn concentration and alloying element effects was derived and verified by comparing the kinetic data obtained using four different solders with different concentrations of Sn and the alloying elements.Originality/valueThe similarity between the activation energies of these four solders confirms that the diffusion of Sn atoms through the IMC is the rate-controlling step. Besides, the kinetic values are independent of the geometry of Ni, whether spherical particle or flat substrate.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jul 12, 2021

Keywords: Reinforcement; Composite solder; Alloying element effect; Intermetallic compound

References

  • Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures
    Chen, C.M.; Chen, S.W.
  • Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions
    Chen, S.W.; Chen, C.M.; Liu, W.C.
  • Effect of adding 0.5 wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0 wt% Sb–0.5 wt% Cu (SSC505) lead free solder alloy
    Eid, E.A.; Fouda, A.N.; Duraia, E.S.; , M.
  • Enhanced ductility and mechanical strength of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solders
    El-Daly, A.A.; El-Taher, A.M.; Dalloul, T.R.
  • Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates
    Fouzder, T.; Li, Q.; Chan, Y.C.; Chan, D.K.
  • Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages
    Gain, A.K.; Chan, Y.C.; Yung, W.K.C.
  • Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates
    Ghosh, G.
  • Composite lead-free electronic solders
    Guo, F.
  • Intermetallic compound formation between Sn–3.5 Ag solder and Ni-based metallization during liquid state reaction
    He, M.; Lau, W.H.; Qi, G.; Chen, Z.
  • Microstructure of a lead-free composite solder produced by an in-situ process
    Hwang, S.Y.; Lee, J.W.; Lee, Z.H.
  • Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solder
    Kang, S.K.; Rai, S.; Purushothaman, R.S.
  • A review: on the development of low melting temperature Pb-free solders
    Kotadia, H.R.; Howes, P.D.; Mannan, S.H.
  • Development of nano-composite lead-free electronic solders
    Lee, A.; Subramanian, K.N.
  • Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders
    Li, Y.; Chan, Y.C.
  • The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates
    Lin, C.Y.; Jao, C.C.; Lee, C.; Yen, Y.W.
  • Effects of Ni particle addition on microstructure and properties of Sn-Ag based composite solders
    Liu, P.; Guo, F.
  • Microstructure influence of SACX0307-TiO2 composite solder joints on thermal properties of power LED assemblies
    Skwarek, A.; Ptak, P.; Górecki, K.; Hurtony, T.; Illés, B.
  • Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints
    Tang, Y.; Luo, S.M.; Huang, W.F.; Pan, Y.C.; Li, G.Y.