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Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders

Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying element.Design/methodology/approachA composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic solders and Ni particles, reacting this composite solder at 250°C–280°C was studied.FindingsExperimental results showed that only the IMC Ni3Sn4 was present as a reaction product. Using the diffusion-controlled reaction mechanism, a kinetic equation quantifying both Sn concentration and alloying element effects was derived and verified by comparing the kinetic data obtained using four different solders with different concentrations of Sn and the alloying elements.Originality/valueThe similarity between the activation energies of these four solders confirms that the diffusion of Sn atoms through the IMC is the rate-controlling step. Besides, the kinetic values are independent of the geometry of Ni, whether spherical particle or flat substrate. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Interfacial reaction between Ni particle reinforcements and liquid Sn-based eutectic solders

Lin, Chung-Yung
Soldering & Surface Mount Technology , Volume 33 (4): 6 – Jul 12, 2021
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References (19)

Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0954-0911
eISSN
0954-0911
DOI
10.1108/ssmt-10-2020-0046
Publisher site
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Abstract

This paper aims to derive a model of growth kinetics of the intermetallic compound (IMC) layer formed in the reaction between liquid Sn-based solders and Ni particle reinforcements and to compare with the experimental data to verify the effects of Sn concentration and alloying element.Design/methodology/approachA composite solder was manufactured by mechanically introducing Ni particle reinforcements into a solder matrix. The effect of the non-reactive alloying elements, Ag, Pb and Bi, on the growth kinetics of the IMC formed between liquid Sn-based eutectic solders and Ni particles, reacting this composite solder at 250°C–280°C was studied.FindingsExperimental results showed that only the IMC Ni3Sn4 was present as a reaction product. Using the diffusion-controlled reaction mechanism, a kinetic equation quantifying both Sn concentration and alloying element effects was derived and verified by comparing the kinetic data obtained using four different solders with different concentrations of Sn and the alloying elements.Originality/valueThe similarity between the activation energies of these four solders confirms that the diffusion of Sn atoms through the IMC is the rate-controlling step. Besides, the kinetic values are independent of the geometry of Ni, whether spherical particle or flat substrate.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jul 12, 2021

Keywords: Reinforcement; Composite solder; Alloying element effect; Intermetallic compound

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