Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Integrated MLC Substrates

Integrated MLC Substrates This paper introduces and describes a new concept in multilayer ceramic capacitor MLC design which dramatically improves final microcircuit packaging density by incorporating buried capacitors in a multilayer ceramic interconnection substrate. This substrate, which is not conventional 94 alumina but a high K replacement, is compatible with conventional air firing thick film conductive, dielectric, and restrictive materials. Included is a discussion of substrate characteristics and potential custom thick film multilayer interconnections. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Integrated MLC Substrates

Hazzard, H.
Microelectronics International , Volume 1 (2): 2 – Feb 1, 1983
Download PDF
2 pages

Loading next page...
 
/lp/emerald-publishing/integrated-mlc-substrates-3OHbFZgPaQ
Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044129
Publisher site
See Article on Publisher Site

Abstract

This paper introduces and describes a new concept in multilayer ceramic capacitor MLC design which dramatically improves final microcircuit packaging density by incorporating buried capacitors in a multilayer ceramic interconnection substrate. This substrate, which is not conventional 94 alumina but a high K replacement, is compatible with conventional air firing thick film conductive, dielectric, and restrictive materials. Included is a discussion of substrate characteristics and potential custom thick film multilayer interconnections.

Journal

Microelectronics International – Emerald Publishing

Published: Feb 1, 1983

There are no references for this article.