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Z. Zhong, V. Venkatesh (1994)
Generation of Parabolic and Toroidal Surfaces on Silicon and Silicon-Based Compounds Using Diamond Cup Grinding WheelsCIRP Annals, 43
C. Poling (2002)
designing a machine-vision systemSpie Newsroom
Z. Zhong, Y. Lu (2003)
Fractal Roughness Structure of Diamond-Turned Copper MirrorsMaterials and Manufacturing Processes, 18
Z. Zhong (2001)
Flip chip assemblies using gold bumps and adhesiveMicroelectronics International, 18
Z. Zhong (2001)
Development of a reliable packaging process for flip chip on ceramicsMicroelectronics International, 18
Z. Zhong, Weiming Lee (2001)
GRINDING OF SILICON AND GLASS USING A NEW DRESSING DEVICE AND AN IMPROVED COOLANT SYSTEMMaterials and Manufacturing Processes, 16
Z. Zhong (1999)
Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfillMicroelectronics International, 16
Z. Zhong (2000)
Assembly issues in three flip chip processesMicroelectronics International, 17
J. Christou, D. Gavel, J. Patience, E. Gates (2002)
Preliminary measurements of residual tip-tilt motion and Strehl ratios for laser guide star compensation at Lick Observatory, 4494
Z. Zhong, Y. Lu (2002)
3D characterization of super-smooth surfaces of diamond turned OFHC copper mirrorsMaterials and Manufacturing Processes, 17
When engineers choose and arrange proper lighting sources for an inspection system, many of them rely on their own experience or guesswork without any guidance of theories. This paper discusses the efficient perception technique, i.e. the TorranceSparrow model and its application to the selection and configuration of light emitting diode LED lighting sources for a package visual inspection system. Inspection of several typical package samples has been evaluated. The image changes of the sample packages are explained using the TorranceSparrow model. The experimental results with the actual gray level values of the images are compared.
Microelectronics International – Emerald Publishing
Published: Aug 1, 2004
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