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References (11)
-
C. Wei, Y. Liu, Yemei Han, J. Wan, Kai Yang (2008)
Microstructures of eutectic Sn–Ag–Zn solder solidified with different cooling ratesJournal of Alloys and Compounds, 464
-
D. Gaskell (2017)
Introduction to the Thermodynamics of Materials -
Kang-I Chen, S. Cheng, Sean Wu, Kwang-Lung Lin (2006)
Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn–9Zn eutectic alloyJournal of Alloys and Compounds, 416
-
Kwang-Lung Lin, Y. Chiu (2005)
The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA SubstrateProceedings Electronic Components and Technology, 2005. ECTC '05.
-
Jenn-Ming Song, K. Lin (2003)
Behavior of intermetallics in liquid Sn–Zn–Ag solder alloysJournal of Materials Research, 18
-
D. Spanner (1964)
Introduction to Thermodynamics -
J. Wan, Y. Liu, C. Wei, Z. Gao, C. Ma (2008)
Effect of Al content on the formation of intermetallic compounds in Sn–Ag–Zn lead-free solderJournal of Materials Science: Materials in Electronics, 19
-
Kwang-Lung Lin, Tzy-Ping Liu (1998)
High-Temperature Oxidation of a Sn-Zn-Al SolderOxidation of Metals, 50
-
Y. Kariya, T. Hosoi, S. Terashima, Masamoto Tanaka, M. Otsuka (2004)
Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnectsJournal of Electronic Materials, 33
-
U. Mohanty, Kwang-Lung Lin (2005)
Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solutionMaterials Science and Engineering A-structural Materials Properties Microstructure and Processing, 406
-
Nai-Shuo Liu, Kwang-Lung Lin (2006)
The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn–8.55Zn–0.5Ag–0.1Al–xGa solders and CuScripta Materialia, 54
- Publisher
- Emerald Publishing
- Copyright
- Copyright © 2009 Emerald Group Publishing Limited. All rights reserved.
- ISSN
- 0954-0911
- DOI
- 10.1108/09540910910989394
- Publisher site
- See Article on Publisher Site
Abstract
Purpose – The purpose of this paper is to study the influence of silver on the high‐temperature oxidation behaviour of the Sn‐8.5Zn‐ x Ag‐0.01Al‐0.1Ga ( x =0, 0.1, 0.3 and 0.5) solder alloys. Design/methodology/approach – The weight gains of the studied solders are measured using thermal gravimetric analyzers (TGA) at temperatures of 250, 300, 350 and 400°C. The weight gains measured are used to compare the oxidation behaviour of the studied solders. The surfaces of the solders are also analyzed with Auger emission spectroscopy (AES) depth profiling and thin‐film X‐ray diffractometry (thin‐film XRD) to identify the elements present on the surface of the studied solders. Findings – The TGA results show that the weight gains decrease with increasing silver content in the studied solders. It meant that increasing silver content could help improve the high‐temperature oxidation behaviour of the studied solder. AES and thin‐film XRD confirm that the formed oxide layers on the surface of the studied solder are Zn‐based oxide layers. Originality/value – The findings of this paper will help provide an understanding of the effects of silver on Sn‐8.5Zn‐ x Ag‐0.01Al‐0.1Ga solder.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Sep 18, 2009
Keywords: Alloys; Solders; Oxidation resistance; Silver; Alloys