Access the full text.
Sign up today, get DeepDyve free for 14 days.
Loading next page...
/lp/emerald-publishing/improvement-of-plating-uniformity-for-copper-patterns-of-ic-substrate-bzCtclACEw
References (43)
-
G. Nikishkov (2021)
Introduction to the finite element methodFinite Element Analysis
-
L. Ji, L. Ji, S. Wang, Chong Wang, Chen Guoqin, Yuanming Chen, Wei‐dong He, Ze Tan (2015)
Improved Uniformity of Conformal Through-Hole Copper Electrodeposition by Revision of Plating Cell ConfigurationJournal of The Electrochemical Society, 162
-
Influence of additives and pulse parameters on uniformity of through-hole copper plating
Transactions of the Institute of Metal Finishing, 88
-
K. Kondo, Yushi Suzuki, Takeyasu Saito, N. Okamoto, Minoru Takauchi (2010)
High Speed Through Silicon Via Filling by Copper ElectrodepositionElectrochemical and Solid State Letters, 13
-
Jing Xiang, Chong Wang, Yuanming Chen, S. Wang, Yan Hong, Huaiwu Zhang, Lijun Gong, Wei‐dong He (2017)
Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substratesApplied Surface Science, 411
-
C. Whiting, K. Jansen (2001)
A stabilized finite element method for the incompressible Navier–Stokes equations using a hierarchical basisInternational Journal for Numerical Methods in Fluids, 35
-
Yu-Tien Lin, Meixia Wang, Chia-Fu Hsu, W. Dow, Shi-Min Lin, Jian-Jun Yang (2013)
Through-Hole Filling in a Cu Plating Bath with Functional Insoluble Anodes and Acetic Acid as a Supporting ElectrolyteJournal of The Electrochemical Society, 160
-
Yu Wang, Wen-Hsi Lee, Shih-Chieh Chang, Jun-Nan Nian, Ying-Lang Wang (2013)
An electroplating method for copper plane twin boundary manufacturingThin Solid Films, 544
-
Y. Tan, K. Lim (2003)
Understanding and improving the uniformity of electrodepositionSurface & Coatings Technology, 167
-
Fan Ai-zhe (2014)
Simulation Analysis of Copper Electroplating of Inductor Coils Based on Finite ElementSurface Technology
-
Yuanming Chen, Wei‐dong He, Xianming Chen, Chong Wang, Zhihua Tao, S. Wang, Guoyun Zhou, M. Moshrefi-Torbati (2014)
Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted ElectrodepositionElectrochimica Acta, 120
-
D. Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee (2006)
Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid arrayIEEE Design & Test of Computers, 23
-
G. McFadden, S. Coriell, T. Moffat, D. Josell, D. Wheeler, W. Schwarzacher, J. Mallett (2003)
A Mechanism for Brightening Linear Stability Analysis of the Curvature-Enhanced Coverage ModelJournal of The Electrochemical Society, 150
-
Qiang Huang, B. Baker-O'Neal, C. Parks, M. Hopstaken, A. Fluegel, C. Emnet, M. Arnold, D. Mayer (2012)
Leveler Effect and Oscillatory Behavior during Copper ElectroplatingJournal of The Electrochemical Society, 159
-
C. Ko, Shoulung Chen, C. Chiang, T. Kuo, Y. Shih, Yu-Hua Chen (2006)
Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP56th Electronic Components and Technology Conference 2006
-
A. Kreider (2012)
Mechanism of SPS acceleration in a PEG containing copper plating bath -
W. Dow, Chih-Chan Li, Mengjiang Lin, G. Su, Chen‐Chia Huang (2009)
Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various LevelersJournal of The Electrochemical Society, 156
-
Z.X. Wang, S. Wang, Z. Yang, Z.L. Wang (2010)
Influence of additives and pulse parameters on uniformity of through-hole copper platingTransactions of the IMF, 88
-
Liu Yang, Tanya Atanasova, A. Radisic, J. Deconinck, A. West, P. Vereecken (2013)
Wafer-scale Cu plating uniformity on thin Cu seed layersElectrochimica Acta, 104
-
W. Dow, M. Yen, S. Liao, Yong-Da Chiu, Hsiao-Chun Huang (2008)
Filling mechanism in microvia metallization by copper electroplatingElectrochimica Acta, 53
-
N. Moës, J. Dolbow, T. Belytschko (1999)
A finite element method for crack growth without remeshingInternational Journal for Numerical Methods in Engineering, 46
-
K. Pantleon, B. Bossche, M. Purcar, Paolo Bariani, Gert Floridor (2005)
Simulation and experimental determination of the macro-scale layer thickness distribution of electrodeposited Cu-line patterns on a wafer substrateJournal of Applied Electrochemistry, 35
-
H. Cao, T. Hang, Huiqin Ling, Ming Li (2013)
Behaviors of Chloride Ions in Methanesulfonic Acid Bath for Copper Electrodeposition of Through-Silicon-ViaJournal of The Electrochemical Society, 160
-
Shanshan Chen, Chifai Cheung, Chenyang Zhao, Fei-hu Zhang (2017)
Simulated and measured surface roughness in high-speed grinding of silicon carbide wafersThe International Journal of Advanced Manufacturing Technology, 91
-
Y. Liu, J. Wang, L. Yin, P. Kondos, C. Parks, P. Borgesen, D. Henderson, S. Bliznakov, E. Cotts, N. Dimitrov (2008)
Improving Copper Electrodeposition in the Microelectronics IndustryIEEE Transactions on Components and Packaging Technologies, 33
-
Liu Yang, A. Radisic, J. Deconinck, P. Vereecken (2013)
Copper Plating Uniformity On Resistive Substrate With Segmented Anode -
M. Crisfield (1978)
A combined Rayleigh-Ritz/finite element method for the nonlinear analysis of stiffened plated structuresComputers & Structures, 8
-
Pintu Kumar, S. Panda (2017)
Numerical simulation of Al1070 alloy through hybrid SPD processThe International Journal of Advanced Manufacturing Technology, 91
-
Li-jun Yang, Ye Ding, Bai Cheng, Abattouy Mohammed, Yang Wang (2017)
Numerical simulation and experimental research on reduction of taper and HAZ during laser drilling using moving focal pointThe International Journal of Advanced Manufacturing Technology, 91
-
Mark Willey, E. McInerney (2009)
Adsorption and Desorption Kinetics of a Block Copolymer Wetting Agent Used in Copper ElectroplatingJournal of The Electrochemical Society, 156
-
Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, F. Leu, Tsung-Fu Yang, C. Ko, Ching-Kuan Lee, C. Shu, Yuan-Chang Lee, Y. Shih (2007)
Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application2007 Proceedings 57th Electronic Components and Technology Conference
-
H. Garich, S. Shimpalee, V. Lilavivat, S. Snyder, E. Taylor (2016)
Non-Traditional Cell Geometry for Improved Copper Plating UniformityJournal of The Electrochemical Society, 163
-
Chaowei Liu, J. Fu, Qiang Xu (2011)
Simultaneous mixed-integer dynamic optimization for environmentally benign electroplatingComput. Chem. Eng., 35
-
Zhifeng Yang, Zhixiang Wang, Xu Wang, Zengling Wang (2011)
Comparison of Bottom-up Filling in Electroless Plating with an Addition of PEG, PPG and EPEChinese Journal of Chemistry, 29
-
M. Neto, A. Amaro, L. Roseiro, J. Cirne, R. Leal (2015)
Introduction to Finite Element Method -
M. Mohammadi, G. Jovanovic, K. Sharp (2013)
Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifoldsComput. Chem. Eng., 52
-
N. Nikolić, G. Branković (2010)
Effect of parameters of square-wave pulsating current on copper electrodeposition in the hydrogen co-deposition rangeElectrochemistry Communications, 12
-
A. Kudelski (2003)
Structures of monolayers formed from different HS—(CH2)2—X thiols on gold, silver and copper: comparitive studies by surface‐enhanced Raman scatteringJournal of Raman Spectroscopy, 34
-
K. Laitinen, J. Miettinen, M. Vauhkonen, R. Lappalainen (2014)
Development of novel electroplating tank layout by computer simulations and verification testsTransactions of the IMF, 92
-
Yazhou Zhang, G. Ding, P. Cheng, Hong Wang (2015)
Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling ProcessJournal of The Electrochemical Society, 162
-
W. Dow, Hsiang-Hao Chen, M. Yen, Cheng-Wei Liu (2007)
Simultaneous Filling of Microvia and Through Hole by Copper Electroplating for High Density Interconnection of PCB, 2
-
Takaharu Hondo, Y. Nitta, K. Nakamura, Hiroyuki Hirano, M. Saruta, T. Inoue, O. Nakao (2013)
Ultra-fine trench circuit on polymer film2013 IEEE 63rd Electronic Components and Technology Conference
-
T. Tsai, Jui-Hsiung Huang (2011)
Electrochemical investigations for copper electrodeposition of through-silicon viaMicroelectronic Engineering, 88
- Publisher
- Emerald Publishing
- Copyright
- © Emerald Publishing Limited
- ISSN
- 0305-6120
- DOI
- 10.1108/cw-12-2017-0078
- Publisher site
- See Article on Publisher Site
Abstract
Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition.Design/methodology/approachPlating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application.FindingsWith disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment.Originality/valueThe comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.
Journal
Circuit World – Emerald Publishing
Published: Jul 16, 2018
Keywords: IC substrate; Current density distribution; Insulating shield; Multiphysics coupling simulation; Pattern design; Plating uniformity improvement