The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tinlead deposit over copper are discussed. The process offers a viable alternative to hot air solder levelling, electrodepositionselective stripping, or inhibitor coatings for maintaining solderability of printed wiring boards. A flat, uniform solderable tinlead coating on all feature surfaces and edges is achieved. A number of important benefits are derived. The ability to coat any copper surface uniformly, including fine pitch features, is substantially enhanced. Solderability is improved because of a thick, flat, coplanar and uniform tinlead deposit on all copper surfaces. Typical thickness and composition of the fused alloy are 150 to 300 microinches 4 to 8 microns and 65 to 75 tin.
Circuit World – Emerald Publishing
Published: Apr 1, 1992
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