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Hybrid Substrates for Power Electronic Applications An Investigation of Thermal Resistance and Mechanical Stress

Hybrid Substrates for Power Electronic Applications An Investigation of Thermal Resistance and... A new hybrid substrate technology for power electronic applications has been characterised by thermal resistance and mechanical stress measurements. The new substrate utilises thermal spray technology for deposition of dielectric layer and electrical conductors. The results are compared with the more established technology of alumina substrates with direct copper bonding DCB metallisation. Silicon test chips for thermal resistance and mechanical stress measurement were used for the characterisation. The experimental results were compared with finite element analysis and a reasonable agreement was found. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Hybrid Substrates for Power Electronic Applications An Investigation of Thermal Resistance and Mechanical Stress

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044490
Publisher site
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Abstract

A new hybrid substrate technology for power electronic applications has been characterised by thermal resistance and mechanical stress measurements. The new substrate utilises thermal spray technology for deposition of dielectric layer and electrical conductors. The results are compared with the more established technology of alumina substrates with direct copper bonding DCB metallisation. Silicon test chips for thermal resistance and mechanical stress measurement were used for the characterisation. The experimental results were compared with finite element analysis and a reasonable agreement was found.

Journal

Microelectronics International – Emerald Publishing

Published: Jan 1, 1993

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