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High quality laser cutting of electronic printed circuit board substrates

High quality laser cutting of electronic printed circuit board substrates Purpose – The purpose of this paper is to discuss laser cutting of FR4, and BT/Epoxy‐based PCB substrates with 355 nm DPSS UV laser. Design/methodology/approach – The effects of various laser conditions such as scanning speed, assisting gas, repetition rate and interval between scans on the heat affected zone (HAZ) and charring are studied. The quality and morphology of laser cut PCB substrates are analyzed with optical microscopy, and scanning electron microscopy (SEM). Also, the laser cut PCB substrates are evaluated by humidity testing and thermal cycle testing. Findings – Multi‐pass cutting at high scanning speed, with O 2 assist gas was found to be able to achieve high quality cutting with little charring. It was also found that a certain time interval between scans and higher repetition rates led to a reduced heat affected zone and less charring. Originality/value – This paper demonstrates high quality laser cutting of PCB substrates with no delamination, little charring and minimum HAZ. The developed process has important potential applications in the electronics industry. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

High quality laser cutting of electronic printed circuit board substrates

Circuit World , Volume 35 (4): 10 – Nov 20, 2009

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References (10)

Publisher
Emerald Publishing
Copyright
Copyright © 2009 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120911002415
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to discuss laser cutting of FR4, and BT/Epoxy‐based PCB substrates with 355 nm DPSS UV laser. Design/methodology/approach – The effects of various laser conditions such as scanning speed, assisting gas, repetition rate and interval between scans on the heat affected zone (HAZ) and charring are studied. The quality and morphology of laser cut PCB substrates are analyzed with optical microscopy, and scanning electron microscopy (SEM). Also, the laser cut PCB substrates are evaluated by humidity testing and thermal cycle testing. Findings – Multi‐pass cutting at high scanning speed, with O 2 assist gas was found to be able to achieve high quality cutting with little charring. It was also found that a certain time interval between scans and higher repetition rates led to a reduced heat affected zone and less charring. Originality/value – This paper demonstrates high quality laser cutting of PCB substrates with no delamination, little charring and minimum HAZ. The developed process has important potential applications in the electronics industry.

Journal

Circuit WorldEmerald Publishing

Published: Nov 20, 2009

Keywords: Lasers; Substrates; Printed circuits

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