Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You and Your Team.

Learn More →

High‐performance substrate from new epoxy resin and enhanced copper foil

High‐performance substrate from new epoxy resin and enhanced copper foil The Dow Chemical Company has developed a new epoxy‐based system to serve the growing need for high‐performance dielectric substrates, requiring high thermal reliability (high T g , high thermal resistance) and high signal speed and integrity (low dielectric constant and low loss factor). The system is based on advanced, proprietary resin technologies. The process latitude of this system is very similar to traditional high T g FR‐4 products. The optimized rheology of the system leads to consistent, controlled flow. The copper foil JTCHTEAB from Gould Electronics, where AB stands for advanced bond, is interesting in this context as it was developed for use on high‐performance laminates with a typically lower ability for copper bonding, such as high T g and low D k / D f substrates. When the “LDk‐HTd” resin is used in combination with the JTCHTEAB copper foil, the copper peel strength fully meets the industry standard for high T g FR‐4 laminates. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

High‐performance substrate from new epoxy resin and enhanced copper foil

Circuit World , Volume 30 (4): 7 – Dec 1, 2004

Loading next page...
 
/lp/emerald-publishing/high-performance-substrate-from-new-epoxy-resin-and-enhanced-copper-quq1wbA42U
Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120410539876
Publisher site
See Article on Publisher Site

Abstract

The Dow Chemical Company has developed a new epoxy‐based system to serve the growing need for high‐performance dielectric substrates, requiring high thermal reliability (high T g , high thermal resistance) and high signal speed and integrity (low dielectric constant and low loss factor). The system is based on advanced, proprietary resin technologies. The process latitude of this system is very similar to traditional high T g FR‐4 products. The optimized rheology of the system leads to consistent, controlled flow. The copper foil JTCHTEAB from Gould Electronics, where AB stands for advanced bond, is interesting in this context as it was developed for use on high‐performance laminates with a typically lower ability for copper bonding, such as high T g and low D k / D f substrates. When the “LDk‐HTd” resin is used in combination with the JTCHTEAB copper foil, the copper peel strength fully meets the industry standard for high T g FR‐4 laminates.

Journal

Circuit WorldEmerald Publishing

Published: Dec 1, 2004

Keywords: Epoxy resins; Adhesion; Thermal stability

References