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High‐performance substrate based on a highly filled thermoplastic polymer

High‐performance substrate based on a highly filled thermoplastic polymer Purpose – The purpose of this paper is to investigate and present the properties of a new substrate material based on thermoplastic polymers (so‐called LuVo Board) for high‐frequency applications. Design/methodology/approach – The thermal, mechanical and electrical properties of a new thermoplastic substrate are investigated and compared to conventional substrates for printed circuit board (PCB) applications. Findings – The new LuVo Board exhibits similar properties to commercially available high‐performance substrates. The main advantage of the LuVo Board is a reduction of manufacturing costs in comparison to conventional substrates, as a highly automated manufacturing process can be employed. Moreover, the LuVo Board exhibits some further advantages: the material is inherently flame resistant and can be thermally shaped after the assembly process. Originality/value – This paper presents an entirely new thermoplastic substrate, which can be employed in high‐frequency applications. In comparison to standard materials, a further advantage of the thermoplastic substrate is lower production costs. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

High‐performance substrate based on a highly filled thermoplastic polymer

Circuit World , Volume 37 (1): 11 – Feb 8, 2011

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References (24)

Publisher
Emerald Publishing
Copyright
Copyright © 2011 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056121111101232
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to investigate and present the properties of a new substrate material based on thermoplastic polymers (so‐called LuVo Board) for high‐frequency applications. Design/methodology/approach – The thermal, mechanical and electrical properties of a new thermoplastic substrate are investigated and compared to conventional substrates for printed circuit board (PCB) applications. Findings – The new LuVo Board exhibits similar properties to commercially available high‐performance substrates. The main advantage of the LuVo Board is a reduction of manufacturing costs in comparison to conventional substrates, as a highly automated manufacturing process can be employed. Moreover, the LuVo Board exhibits some further advantages: the material is inherently flame resistant and can be thermally shaped after the assembly process. Originality/value – This paper presents an entirely new thermoplastic substrate, which can be employed in high‐frequency applications. In comparison to standard materials, a further advantage of the thermoplastic substrate is lower production costs.

Journal

Circuit WorldEmerald Publishing

Published: Feb 8, 2011

Keywords: Thermoplastic polymers; Dielectric properties; Substrates; Printed circuits; High temperatures; Moisture

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