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High frequency modelling approach of onchip interconnects considering conductor and substrate skin effects

High frequency modelling approach of onchip interconnects considering conductor and substrate... Simple and accurate high frequency modelling approach of onchip interconnects on a lossy silicon substrate, that considers conductor and substrate skin effects, is presented. The closedform formulas for the frequencydependent series impedance parameters are obtained using a closedform integration method and the vector magnetic potential equation. The proposed frequencydependent inductance Lf and resistance Rf per unit length formulas are shown to be in good agreement with the electromagnetic solutions. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

High frequency modelling approach of onchip interconnects considering conductor and substrate skin effects

Ymeri, H.; Nauwelaers, B.; Maex, K.
Microelectronics International , Volume 21 (1): 4 – Apr 1, 2004
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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360410517111
Publisher site
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Abstract

Simple and accurate high frequency modelling approach of onchip interconnects on a lossy silicon substrate, that considers conductor and substrate skin effects, is presented. The closedform formulas for the frequencydependent series impedance parameters are obtained using a closedform integration method and the vector magnetic potential equation. The proposed frequencydependent inductance Lf and resistance Rf per unit length formulas are shown to be in good agreement with the electromagnetic solutions.

Journal

Microelectronics International – Emerald Publishing

Published: Apr 1, 2004

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