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References (12)
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The Application of an Eutectic Gold-Tin Cushion for TAB-Inner Lead Bonding with Reduced Bonding Pressure -
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Extremely reliable bonding of large silicon dice using gold-tin alloy40th Conference Proceedings on Electronic Components and Technology
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Optical absorption aspects of laser soldering for high density interconnects.Applied optics, 28 21
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P. Spletter, R. Crowley (1990)
A laser based system for tape automated bonding to integrated circuits40th Conference Proceedings on Electronic Components and Technology
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 0954-0911
- DOI
- 10.1108/eb037800
- Publisher site
- See Article on Publisher Site
Abstract
Tape automated bonding TAB is a suitable technology for assembling ICs with a high number of lOs. The gang bonding process usually applied requires increasing thermode forces for chips with high lead counts and narrow tolerances regarding thermode parallelism and planarity. Due to the high bonding pressure, TC bonding of Au bumps to Auplated tapes becomes critical for these applications. In order to avoid damage to the pad structure an inner lead bonding ILB process with reduced pressure is required. A tape metallisation of 0.51.0 m Sn is not sufficient for a significant reduction of thermode pressure. As an alternative, the application of an eutectic AuSn cushion which is deposited on top of the bumps is presented. A modified bumping process was developed for the deposition of the solder bumps. Soldering of the AuSn bumps to a Auplated tape was performed successfully by two techniques thermode gang bonding and laser soldering. Bond parameters and tin layer thickness were optimised. Reliability investigations by thermal ageing were performed. The special metallurgical aspects of the system were investigated with a microprobe.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Mar 1, 1992