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/lp/emerald-publishing/geometrical-and-electrical-properties-of-ltcc-and-thickfilm-Dslb12MW44
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565360510575521
- Publisher site
- See Article on Publisher Site
Abstract
Purpose This paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thickfilm and LTCC microresistors with designed dimensions between 5050m2 and 800200m2.Designmethodologyapproach The geometrical parameters average length, width and thickness, relations between designed and real dimensions, distribution of planar dimensions are correlated with basic electrical properties of resistors sheet resistance and its distribution, hot temperature coefficient of resistance and its distribution distribution as well as long term thermal stability and durability of microresistors to short electrical pulses.Findings Fodel process gives better resolution than standard screenprinting and leads to smaller dimensions than designed, smaller absolute error and better uniformity of planar sizes. Microresistors made in full Fodel process show much weaker dimensional effect and exhibit noticeably smaller distribution of basic electrical properties.Originalityvalue Presents systematic studies of a wide spectrum of geometrical and electrical properties of thickfilm and LTCC microresistors.
Journal
Microelectronics International – Emerald Publishing
Published: Apr 1, 2005