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/lp/emerald-publishing/fourier-and-wavelet-transform-analysis-of-moire-fringe-patterns-in-uOl3RVN1Nu
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565360410532024
- Publisher site
- See Article on Publisher Site
Abstract
In this paper, two transform methods, the Fourier transform FT and the wavelet transform WT methods, are utilized to process moir fringes for the strain analysis of electronic packaging. With the introduction of fringe carriers, those transform techniques need only one fringe pattern for each deformation state. The strain modulation to the carrier frequency can be subtracted by filtering as the pattern is transformed into spectrum domain by the fastFT processing, and the deformation field can thus be restored by the inverse FT transform after spectral shifting. The WT method expands the pattern information involved in the fringe carrier in both spatial domain and spectral domain to analyze the deformation distribution in this combined space. By changing the transform scales in the processing, the wavelet transform offers multiresolution analysis for the deformation field with high gradients.
Journal
Microelectronics International – Emerald Publishing
Published: Aug 1, 2004