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Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging

Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging In this paper, two transform methods, the Fourier transform FT and the wavelet transform WT methods, are utilized to process moir fringes for the strain analysis of electronic packaging. With the introduction of fringe carriers, those transform techniques need only one fringe pattern for each deformation state. The strain modulation to the carrier frequency can be subtracted by filtering as the pattern is transformed into spectrum domain by the fastFT processing, and the deformation field can thus be restored by the inverse FT transform after spectral shifting. The WT method expands the pattern information involved in the fringe carrier in both spatial domain and spectral domain to analyze the deformation distribution in this combined space. By changing the transform scales in the processing, the wavelet transform offers multiresolution analysis for the deformation field with high gradients. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360410532024
Publisher site
See Article on Publisher Site

Abstract

In this paper, two transform methods, the Fourier transform FT and the wavelet transform WT methods, are utilized to process moir fringes for the strain analysis of electronic packaging. With the introduction of fringe carriers, those transform techniques need only one fringe pattern for each deformation state. The strain modulation to the carrier frequency can be subtracted by filtering as the pattern is transformed into spectrum domain by the fastFT processing, and the deformation field can thus be restored by the inverse FT transform after spectral shifting. The WT method expands the pattern information involved in the fringe carrier in both spatial domain and spectral domain to analyze the deformation distribution in this combined space. By changing the transform scales in the processing, the wavelet transform offers multiresolution analysis for the deformation field with high gradients.

Journal

Microelectronics InternationalEmerald Publishing

Published: Aug 1, 2004

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