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Soon-Min Hong, C. Kang, J. Jung (2002)
Flux-free direct chip attachment of solder-bump flip chip by Ar + H2 plasma treatmentJournal of Electronic Materials, 31
Soon-Min Hong, C. Kang, J. Jung (2002)
Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic WaveMaterials Transactions, 43
G. Takyi, Nduka Ekere, K. Snowdon, C. Tanner (1999)
EVALUATION OF PLASMA TREATED HASL FINISH PCBs USING DCA MEASUREMENTSJournal of Electronics Manufacturing, 09
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Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packagesSoldering & Surface Mount Technology, 14
C.B. Park, S.M. Hong, J.P. Jung, C.S. Kang, Y.E. Shin
A study on the fluxless soldering of Si‐wafer/glass substrate using Sn‐3.5mass%Ag and Sn‐37mass%Pb solder
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CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strengthIEEE Transactions on Components and Packaging Technologies, 26
Soon-Min Hong, C. Kang, J. Jung (2004)
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Chang-Bae Park, Soon-Min Hong, J. Jung, C. Kang, Yong-Eui Shin (2001)
A study on the fluxless soldering of Si-wafer/glass substrate using Sn-3.5 mass%Ag and Sn-37 mass%Pb solder : Special issue on basic science and advanced technology of lead-free electronics packagingMaterials Transactions Jim, 42
Purpose – To investigate fluxless plasma ball bumping and effect of under bump metallization (UBM) thickness on joint properties using lead‐free solders. Design/methodology/approach – A fluxless soldering process was investigated in this study using Ar‐10 percent H 2 plasma reflow. Balls made from two lead‐free solders (Sn‐3.5 weight percent Ag and Sn‐3.5 weight percent Ag‐0.7 weight percent Cu) were reflowed and, also Sn‐37 weight percent Pb as a reference. In particular, the effects of the UBM thickness on the interfacial metallurgical bonding and joint strength were studied. The UBM (Au/Cu/Ni/Al layers) thicknesses were 20 nm/0.3 μ m/0.4 μ m/0.4 μ m and 20 nm/4 μ m/4 μ m/0.4 μ m, respectively. Findings – The experimental results showed that in the case of a thin UBM the shear strengths of the soldered joints were relatively low (about 19‐27 MPa) due to cracks observed along the bond interfaces. The thick UBM improved joint strength to 32‐42 MPa as the consumption of the Cu and Ni layers by reaction with the solder was reduced and hence the interfacial cracks were avoided. To provide a benchmark, reflow of the solders in air using flux was also carried out. Originality/value – This paper provides information about the effect of UBM thickness on joint strength for plasma fluxless soldering to researchers and engineers.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Jun 1, 2005
Keywords: Soldering; Joining processes; Strength of materials; Organometallic compounds
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