Access the full text.
Sign up today, get DeepDyve free for 14 days.
References for this paper are not available at this time. We will be adding them shortly, thank you for your patience.
Personal electronic devices at the user interface, like cell phones, utilize BGA/CSP structure for miniaturization of circuits. These structures are subjected to severe thermal loads due to environment of use. Starting with a microstructure of a failed board due to thermal cycles, the stresses/strains in this structure were analyzed from –408C to 1258C. In the finite element models (ABAQUS), we represented the structure as a composite of three‐dimensional (3‐D) elastic materials. The model showed stress/strain/energy concentrations at the actual failure points. The model also provided a route to improved durability by reducing these failure potentials, through change in the substrate of the printed circuit board (PCB). We observed significant reduction in failure potential when resin coated copper was replaced by THERMOUNT1 in PCB. This improved performance can be directly related to better‐matched modulus and coefficient of thermal expansion (CTE) of the PCB substrate to the chip (silicon). A more sophisticated model is under construction, where the time dependent material properties and non‐linear effects such as solder creep will be included.
Circuit World – Emerald Publishing
Published: Dec 1, 2001
Keywords: Finite element modelling; Durability; Ball grid array; Chip scale packaging; Thermal stress
Read and print from thousands of top scholarly journals.
Already have an account? Log in
Bookmark this article. You can see your Bookmarks on your DeepDyve Library.
To save an article, log in first, or sign up for a DeepDyve account if you don’t already have one.
Copy and paste the desired citation format or use the link below to download a file formatted for EndNote
Access the full text.
Sign up today, get DeepDyve free for 14 days.
All DeepDyve websites use cookies to improve your online experience. They were placed on your computer when you launched this website. You can change your cookie settings through your browser.