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Fine Line Conductor Formation

Fine Line Conductor Formation Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, platingetching, photoexposure, automatic optical inspection, etc. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Fine Line Conductor Formation

Circuit World , Volume 18 (2): 5 – Jan 1, 1992

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046158
Publisher site
See Article on Publisher Site

Abstract

Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, platingetching, photoexposure, automatic optical inspection, etc.

Journal

Circuit WorldEmerald Publishing

Published: Jan 1, 1992

There are no references for this article.