Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Figures of Merit Design Tools for Surface Mount Solder Joint Reliability

Figures of Merit Design Tools for Surface Mount Solder Joint Reliability In early 1989 the original version of the Reliability Figures of Merit FM for the solder attachments of surface mount SM assemblies was published. That version of the FM was specifically tailored for telecommunications environments. Misapplications of FMs to use environments, such as military applications and accelerated tests, pointed to a real need for generally applicable FMs. Adequate reliability of SM solder connections can only be assured with a Design for Reliability based on solder joint behaviour and the underlying fatigue damage mechanisms. Perceived difficulties with a Design for Reliability stem from the very complex and only partially understood nature of the interacting mechanisms underlying thermally induced solder joint fatigue, combined with the highly temperature, time, and stressdependent behaviour of some of the materials involved, especially solder. In this paper generic FMs are presented. These are simple design tools, easily applied by users unfamiliar with the underlying complexities of solder fatigue and the reliability assessment results are in GoNogo format. The oversimplifications contained in Version 1 of the FMs originally thought necessary for simple design tools and limiting their applicability are omitted, making these generic FMs more readily understood. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Figures of Merit Design Tools for Surface Mount Solder Joint Reliability

Engelmaier, W.
Soldering & Surface Mount Technology , Volume 4 (1): 6 – Jan 1, 1992
Download PDF
6 pages

Loading next page...
 
/lp/emerald-publishing/figures-of-merit-design-tools-for-surface-mount-solder-joint-UCDdNer3tH

References (10)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037775
Publisher site
See Article on Publisher Site

Abstract

In early 1989 the original version of the Reliability Figures of Merit FM for the solder attachments of surface mount SM assemblies was published. That version of the FM was specifically tailored for telecommunications environments. Misapplications of FMs to use environments, such as military applications and accelerated tests, pointed to a real need for generally applicable FMs. Adequate reliability of SM solder connections can only be assured with a Design for Reliability based on solder joint behaviour and the underlying fatigue damage mechanisms. Perceived difficulties with a Design for Reliability stem from the very complex and only partially understood nature of the interacting mechanisms underlying thermally induced solder joint fatigue, combined with the highly temperature, time, and stressdependent behaviour of some of the materials involved, especially solder. In this paper generic FMs are presented. These are simple design tools, easily applied by users unfamiliar with the underlying complexities of solder fatigue and the reliability assessment results are in GoNogo format. The oversimplifications contained in Version 1 of the FMs originally thought necessary for simple design tools and limiting their applicability are omitted, making these generic FMs more readily understood.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jan 1, 1992

There are no references for this article.