Fatigue Fracture of Leads of SMT Components Caused by Ultrasonic Cleaning

Fatigue Fracture of Leads of SMT Components Caused by Ultrasonic Cleaning Ultrasonic cleaning is an effective aid in the removal of flux residues from surface mounted circuits. However, an overintensive and too extended ultrasonic load of surfacemounted electronic circuits, on ceramic substrates, occasionally causes the fracture of component leads. In a metallurgical study, it was found that the fracture mechanism is fatigue. The fundamental cure for this problem is to limit the ultrasonic load to a level below the fatigue limit of the leads. This can be achieved by limiting the ultrasonic power input in the bath. Other beneficial measures are to limit the cleaning time and the ultrasonic frequency, and to prevent the components from coming into contact with other parts during cleaning. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Fatigue Fracture of Leads of SMT Components Caused by Ultrasonic Cleaning

Microelectronics International, Volume 5 (2): 4 – Feb 1, 1988

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044320
Publisher site
See Article on Publisher Site

Abstract

Ultrasonic cleaning is an effective aid in the removal of flux residues from surface mounted circuits. However, an overintensive and too extended ultrasonic load of surfacemounted electronic circuits, on ceramic substrates, occasionally causes the fracture of component leads. In a metallurgical study, it was found that the fracture mechanism is fatigue. The fundamental cure for this problem is to limit the ultrasonic load to a level below the fatigue limit of the leads. This can be achieved by limiting the ultrasonic power input in the bath. Other beneficial measures are to limit the cleaning time and the ultrasonic frequency, and to prevent the components from coming into contact with other parts during cleaning.

Journal

Microelectronics InternationalEmerald Publishing

Published: Feb 1, 1988

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