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Failure analysis of lead‐free solder joints for high‐density packages

Failure analysis of lead‐free solder joints for high‐density packages Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Failure analysis of lead‐free solder joints for high‐density packages

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References (11)

Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910410537345
Publisher site
See Article on Publisher Site

Abstract

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Aug 1, 2004

Keywords: Solders; Product reliability; Joining processes; Printed‐circuit boards

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