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Fabrication of High Density Multichip Modules with Standard IC Production Equipment

Fabrication of High Density Multichip Modules with Standard IC Production Equipment Since the first appearance of high density interconnection systems about ten years ago, researchers have tried to exploit this concept to the full. By introducing new technologies and materials, they have succeeded in building a module that equals wafer scale integration WSI in speed and efficiency. However, MCMs have not yet experienced rapid growth and acceptance as a result of the large capital investment and rather small volumes involved. This paper sets out to show that MCMs can be fabricated using technology and processes already in existence at most conventional IC and thinfilm production facilities. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Fabrication of High Density Multichip Modules with Standard IC Production Equipment

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044488
Publisher site
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Abstract

Since the first appearance of high density interconnection systems about ten years ago, researchers have tried to exploit this concept to the full. By introducing new technologies and materials, they have succeeded in building a module that equals wafer scale integration WSI in speed and efficiency. However, MCMs have not yet experienced rapid growth and acceptance as a result of the large capital investment and rather small volumes involved. This paper sets out to show that MCMs can be fabricated using technology and processes already in existence at most conventional IC and thinfilm production facilities.

Journal

Microelectronics International – Emerald Publishing

Published: Jan 1, 1993

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