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Mohammad Gharaibeh (2018)
Reliability assessment of electronic assemblies under vibration by statistical factorial analysis approachSoldering & Surface Mount Technology
Mohammad Gharaibeh (2018)
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Board-Level Drop Test : Comparison of Two ANSYS Modeling Approaches and Correlation with Testing
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Cratering : Reliability of Assembly Level and Joint Level
Mohammad Gharaibeh (2018)
Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodologyMicroelectron. Reliab., 84
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Mohammad Gharaibeh, Quang Su, J. Pitarresi (2018)
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This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder alloys, in vibration loading conditions.Design/methodology/approachReliability tests were conducted using a sine dwell with resonance tracking vibration experiment. Finite element simulations were performed to help in understanding the observed failure trends.FindingsReliability results showed that the tin-lead solders out-perform lead-free solders in vibrations loading. Additionally, the LGA solder type could provide a better vibration reliability performance than BGA solders. Failure analysis results showed that in LGAs, the crack is initiated at the printed circuit board side and at the component side in BGAs. In both types, the crack is propagated throughout in the intermetallic compound layer.Originality/valueIn literature, there is a lack of published data in the comparison between LGA and BGA reliability performance in vibration loadings. This paper provides useful insights in the vibration reliability behavior of the two common solder joint types.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Apr 16, 2019
Keywords: Finite element modelling (FEM); Reliability; Ball grid array (BGA); Land grid array (LGA)
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