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Z. Moser, W. Gąsior, A. Dębski, J. Pstruś
Database of Lead‐Free Soldering Materials
Jian Zhou, Yangshan Sun, F. Xue (2005)
Properties of low melting point Sn–Zn–Bi soldersJournal of Alloys and Compounds, 397
Z. Moser, W. Gasior, J. Pstruś, I. Ohnuma, K. Ishida (2006)
Influence of Sb additions on surface tension and density of Sn–Sb, Sn–Ag–Sb andSn–Ag–Cu–Sb alloys: Experiment vs. modelingInternational Journal of Materials Research, 97
Z. Moser, W. Gasior, J. Pstruś, S. Ishihara, Xingjun Liu, I. Ohnuma, R. Kainuma, K. Ishida (2004)
Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary systemMaterials Transactions, 45
K. Friedel, R. Kisiel, W. Łoziński
A study of wetting performance of lead‐free solders
R. Mayappan, A. Ismail, Z. Ahmad, T. Ariga, L. Hussain (2006)
Effect of sample perimeter and temperature on Sn–Zn based lead-free soldersMaterials Letters, 60
W. Gasior, Z. Moser, J. Pstruś, K. Bukat, J. Sitek, R. Kisiel (2004)
(Sn-Ag)eut+Cu soldering materials, part I: Wettability studiesJournal of Phase Equilibria and Diffusion, 25
B. Willis (2003)
Environmental-Friendly Electronics: Lead-Free TechnologySoldering & Surface Mount Technology, 15
I. Ohnuma, K. Ishida, Z. Moser, S. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek (2006)
Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additionsJournal of Phase Equilibria and Diffusion, 27
K. Bukat, Z. Moser, W. Gasior, J. Sitek, M. Kościelski, J. Pstruś (2008)
Trends in wettability studies df Pb-free solders. Basic and application. Part II. Relation between surface tension, interfacial tension and wertability of lead-free Sn-Zn and Sn-Bi-Sb alloysArchives of Metallurgy and Materials
E. Lopez, P. Vianco, J. Rejent (2005)
Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated kovar substratesJournal of Electronic Materials, 34
Z. Moser, W. Gasior, K. Bukat, J. Pstruś, J. Sitek (2008)
Trends in wettability studies of Pb-free solders. Basic and application. Part I. Surface tension and density measurements of Sn-Zn- and Sn-Zn-Bi-Sb alloys. Experiment vs. modellingArchives of Metallurgy and Materials
N. Katayama, H. Tanaka, M. Akanuma, M. Myiazaki, S. Ogata, A. Yoshida, Y. Nishiyama
Wave soldering process with Sn‐Zn lead‐free solders
J. Stufken (1992)
Taguchi Methods: A Hands-On Approach
M. Miyazaki, M. Mizutani, T. Takemoto, A. Matsunawa (1997)
Measurement of Surface Tension with Wetting Balance.Quarterly Journal of The Japan Welding Society, 15
Jennie Hwang (2004)
Implementing Lead-Free Electronics
M. Miyazaki, M. Mizutani, T. Takemoto, A. Matsunawa
Condition for measurement of surface tension of solders with a wetting balance tester
Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida, I. Ohnuma (2006)
Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb AdditionsJournal of Phase Equilibria and Diffusion, 28
D. Yu, H. Xie, L. Wang (2004)
Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrateJournal of Alloys and Compounds, 385
Purpose – The purpose of this paper is a comparable evaluation of the influence of a particular element (Bi and Sb) added to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface and interfacial tensions, as well as the wetting properties on the Cu substrate expressed by the wetting angle. Design/methodology/approach – The authors applied the L 8 orthogonal Taguchi array to carry out the experiments and discussed the results using analysis of variance (ANOVA). Findings – It was expected, on the base of previous studies, the decrease of the surface and interfacial tensions and thus improving wettability after the Bi and Sb addition to Sn‐Ag‐Cu and Sn‐Zn alloys. Unfortunately, the obtained results on the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys and the quaternary Sn‐Zn‐Bi‐Sb alloys do not confirm these trends. The performed analyses suggest that the compositions of the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys, as well as the quaternary Sn‐Zn‐Bi‐Sb alloys, do not have optimal compositions for practical application. The Cu, Bi and Sb elements in the case of the Sn‐Ag‐Cu‐Bi‐Sb alloys and the Zn, Bi and Sb elements in the case of the Sn‐Zn‐Bi‐Sb alloys show mutual interaction and, in consequence, there is no correlation between the tendency of the surface and interfacial tensions changes and the wettings of the Cu substrate. Research limitations/implications – It is suggested that further studies are necessary for the purpose of the practical application, but they should be limited mainly to the Sn‐Ag‐Cu‐Bi and the Sn‐Zn‐Bi alloys with the optimal compositions. Practical implications – The performed analysis suggests that none of the investigated compositions of the quinary Sn‐Ag‐Cu‐Bi‐Sb alloys, as well as the quaternary Sn‐Zn‐Bi‐Sb alloys, have the optimal compositions for practical application. Originality/value – The quickest way to determine which element of the alloy composition influences the surface tension and the wetting properties, and how, is to apply orthogonal analysis. After choosing the orthogonal array, the experiments were performed and analysis of variance (ANOVA) was used to perform the quantifiable analysis of the measured and calculated results of surface and interfacial tensions, as well as the wetting properties on the Cu substrate.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Sep 19, 2008
Keywords: Alloys; Solders; Surface chemistry
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