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ESCA Analysis of Ageing of Metallic Surfaces Solderability of Nickel Silver

ESCA Analysis of Ageing of Metallic Surfaces Solderability of Nickel Silver Because of recent interest in nickel silver copperzincnickel alloy in electronic applications, this alloy was chosen for an ageingsolderability study. An AugerESCA study was performed on the surface of samples of nickel silver to determine the chemical nanostructure at various degrees of ageing 02 years. During this time a redistribution of the three constituent metals occurred, with migration of copper to the surface. All three metal constituents oxidised at different rates. Additionally, the thickness of the surface carbon layer increased with time. The effect of physical abrading cleaning by erasing of the samples on solderability, ageing, and chemical surface was also studied. After erasure, all samples appeared similar to one another and close to the original composition, and the copper oxide layer was completely removed. All the cleaned surfaces, when returned to the atmosphere, experienced air oxidation of copper to copper oxide in less than two days. Angleresolved ESCA studies were performed to determine the concentration gradient close to the surface. Nickel was not evenly distributed with depth, but was more concentrated on the surface of the cleaned samples. Solderability studies on nickel silver samples showed no improvement with chemical treatment, attesting to the creation of a resistant passivation layer. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

ESCA Analysis of Ageing of Metallic Surfaces Solderability of Nickel Silver

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References (13)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/eb037738
Publisher site
See Article on Publisher Site

Abstract

Because of recent interest in nickel silver copperzincnickel alloy in electronic applications, this alloy was chosen for an ageingsolderability study. An AugerESCA study was performed on the surface of samples of nickel silver to determine the chemical nanostructure at various degrees of ageing 02 years. During this time a redistribution of the three constituent metals occurred, with migration of copper to the surface. All three metal constituents oxidised at different rates. Additionally, the thickness of the surface carbon layer increased with time. The effect of physical abrading cleaning by erasing of the samples on solderability, ageing, and chemical surface was also studied. After erasure, all samples appeared similar to one another and close to the original composition, and the copper oxide layer was completely removed. All the cleaned surfaces, when returned to the atmosphere, experienced air oxidation of copper to copper oxide in less than two days. Angleresolved ESCA studies were performed to determine the concentration gradient close to the surface. Nickel was not evenly distributed with depth, but was more concentrated on the surface of the cleaned samples. Solderability studies on nickel silver samples showed no improvement with chemical treatment, attesting to the creation of a resistant passivation layer.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Jan 1, 1991

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