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- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 0036-8792
- DOI
- 10.1108/ILT-06-2012-0054
- Publisher site
- See Article on Publisher Site
Abstract
Purpose – The purpose of this paper was to demonstrate the influence of a 3-aminopropyl-triethoxysilane–polyacrylic acid (amino propyl silane (APS)-PAA) buffer layer on the tribological performance of copper sulfide (CuS) thin film on silicon (Si) substrate. Design/methodology/approach – The APS-PAA buffer layer was first deposited on Si substrate by a self-assembling method. Then, the deposited film was coated by a CuS film by a successive ionic layer absorption and reaction (SILAR) method. The structures and morphologies of the prepared films were characterized by X-ray diffraction and atomic force microscopy. The results showed that the prepared CuS film with a PAA-APS double layer had a good crystallinity and surface morphology. The tribological performance of the prepared film was analyzed on UMT-2 tribometer and scanning electric microscope. Findings – With use of an APS-PAA buffer layer, the CuS thin films became compact, smooth and uniform. The tribological performance of the CuS film was greatly enhanced by using an APS-PAA buffer layer. Originality/value – The paper is the first to demonstrate that the CuS film exhibited enhanced structure, morphology and tribological characteristics by using an APS-PAA buffer layer.
Journal
Industrial Lubrication and Tribology – Emerald Publishing
Published: Feb 9, 2015