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Embedding and assembly of ultrathin chips in multilayer flex boards

Embedding and assembly of ultrathin chips in multilayer flex boards Purpose – The purpose of this paper is to present results from the EC funded project SHIFT (Smart High Integration Flex Technologies) on the embedding in and the assembly on flex substrates of ultrathin chips. Design/methodology/approach – Methods to embed chips in flex include flip‐chip assembly and subsequent lamination, or the construction of a separate ultra‐thin chip package (UTCP) using spin‐on polyimides and thin‐film metallisation technology. Thinning and separation of the chips is done using a “dicing‐by‐thinning” method. Findings – The feasibility of both chip embedding methods has been demonstrated, as well as that of the chip thinning method. Lamination of four layers of flex with ultrathin chips could be achieved without chip breakage. The UTCP technology results in a 60 μ m package where also the 20 μ m thick chip is bendable. Research limitations/implications – Further development work includes reliability testing, embedding of the UTCP in conventional flex, and construction of functional demonstrators using the developed technologies. Originality/value – Thinning down silicon chips to thicknesses of 25 μ m and lower is an innovative technology, as well as assembly and embedding of these chips in flexible substrates. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Embedding and assembly of ultrathin chips in multilayer flex boards

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References (10)

Publisher
Emerald Publishing
Copyright
Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
ISSN
0305-6120
DOI
10.1108/03056120810896209
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to present results from the EC funded project SHIFT (Smart High Integration Flex Technologies) on the embedding in and the assembly on flex substrates of ultrathin chips. Design/methodology/approach – Methods to embed chips in flex include flip‐chip assembly and subsequent lamination, or the construction of a separate ultra‐thin chip package (UTCP) using spin‐on polyimides and thin‐film metallisation technology. Thinning and separation of the chips is done using a “dicing‐by‐thinning” method. Findings – The feasibility of both chip embedding methods has been demonstrated, as well as that of the chip thinning method. Lamination of four layers of flex with ultrathin chips could be achieved without chip breakage. The UTCP technology results in a 60 μ m package where also the 20 μ m thick chip is bendable. Research limitations/implications – Further development work includes reliability testing, embedding of the UTCP in conventional flex, and construction of functional demonstrators using the developed technologies. Originality/value – Thinning down silicon chips to thicknesses of 25 μ m and lower is an innovative technology, as well as assembly and embedding of these chips in flexible substrates.

Journal

Circuit WorldEmerald Publishing

Published: Aug 22, 2008

Keywords: Assembly; Integrated circuits; Silicon; Laminates

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