Eliminating Solvents in the Cleaning of Circuit Assemblies A Case History

Eliminating Solvents in the Cleaning of Circuit Assemblies A Case History This paper describes the work that was necessary to eliminate CFC chlorofluorocarbon cleaning solvents in the postsoldering defluxing operation during assembly of printed wiring assemblies PWA in an offshore electronics manufacturing plant. The pressuresboth external and internalto utilise environmentally clean processes are becoming increasingly great in offshore manufacturing facilities, just as throughout the US. However, as will be shown in this paper, producers of electronic equipment must continue to ensure that a high level of product performance and reliability is not sacrificed when going to more environmentally favourable materials and processes. The study described here consisted of examining several watersoluble flux materials, measuring ionic contamination levels of both Freon TMScleaned and watercleaned assemblies, and functional testing of the assembled devices at various levels of functional test severity. Materials, methods and actual physical data are presented in this paper. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Eliminating Solvents in the Cleaning of Circuit Assemblies A Case History

Circuit World, Volume 17 (3): 5 – Feb 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046136
Publisher site
See Article on Publisher Site

Abstract

This paper describes the work that was necessary to eliminate CFC chlorofluorocarbon cleaning solvents in the postsoldering defluxing operation during assembly of printed wiring assemblies PWA in an offshore electronics manufacturing plant. The pressuresboth external and internalto utilise environmentally clean processes are becoming increasingly great in offshore manufacturing facilities, just as throughout the US. However, as will be shown in this paper, producers of electronic equipment must continue to ensure that a high level of product performance and reliability is not sacrificed when going to more environmentally favourable materials and processes. The study described here consisted of examining several watersoluble flux materials, measuring ionic contamination levels of both Freon TMScleaned and watercleaned assemblies, and functional testing of the assembled devices at various levels of functional test severity. Materials, methods and actual physical data are presented in this paper.

Journal

Circuit WorldEmerald Publishing

Published: Feb 1, 1991

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