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Electroplating of Thick and Ductile Palladiumnickel Alloys

Electroplating of Thick and Ductile Palladiumnickel Alloys Electroplating of palladiumnickel alloy is becoming widely used, mainly for interconnection applications in the electronics industry and for decorative purposes. Enhanced hardness and brightness combined with superior wear properties compared with hard gold deposits make this alloy desirable in many applications. Like pure palladium, palladiumnickel is frequently covered with a thin layer of hard gold to improve contact reliability this results in a much less expensive and longerlasting contact material than hard gold on its own. In response to the growing demand, the authors have developed a palladiumnickel alloy electroplating process that can plate alloys of varying composition 1050 w Ni at current densities ranging from <5 mAcm to >500 mAcm. This process produces specular, hard and ductile deposits up to a thickness of 25 m. The new palladiumnickel alloy electroplating process is described with regard to its chemistry, operating conditions, bath maintenance and regeneration, diagnostic measures, and properties of the electrodeposits. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Electroplating of Thick and Ductile Palladiumnickel Alloys

Circuit World , Volume 17 (2): 7 – Jan 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046121
Publisher site
See Article on Publisher Site

Abstract

Electroplating of palladiumnickel alloy is becoming widely used, mainly for interconnection applications in the electronics industry and for decorative purposes. Enhanced hardness and brightness combined with superior wear properties compared with hard gold deposits make this alloy desirable in many applications. Like pure palladium, palladiumnickel is frequently covered with a thin layer of hard gold to improve contact reliability this results in a much less expensive and longerlasting contact material than hard gold on its own. In response to the growing demand, the authors have developed a palladiumnickel alloy electroplating process that can plate alloys of varying composition 1050 w Ni at current densities ranging from <5 mAcm to >500 mAcm. This process produces specular, hard and ductile deposits up to a thickness of 25 m. The new palladiumnickel alloy electroplating process is described with regard to its chemistry, operating conditions, bath maintenance and regeneration, diagnostic measures, and properties of the electrodeposits.

Journal

Circuit WorldEmerald Publishing

Published: Jan 1, 1991

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