In this study, the reliability of solder joints and platedthrough hole copper padsbarrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The crosssections of the reworked PGA assemblies before and after fatigue tests are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the loaddrop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life.
Circuit World – Emerald Publishing
Published: Mar 1, 1991