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Effects of Rework on the Reliability of Pin Grid Array Interconnects

Effects of Rework on the Reliability of Pin Grid Array Interconnects In this study, the reliability of solder joints and platedthrough hole copper padsbarrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The crosssections of the reworked PGA assemblies before and after fatigue tests are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the loaddrop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Effects of Rework on the Reliability of Pin Grid Array Interconnects

Circuit World , Volume 17 (4): 6 – Mar 1, 1991

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046140
Publisher site
See Article on Publisher Site

Abstract

In this study, the reliability of solder joints and platedthrough hole copper padsbarrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The crosssections of the reworked PGA assemblies before and after fatigue tests are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the loaddrop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1991

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