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Effect of wire diameter and hook location on second bond failure modes

Effect of wire diameter and hook location on second bond failure modes Purpose– This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained. Design/methodology/approach– Two hook locations, namely, location A and location B were used to analyze the effect of hook location. Location A was the same as the hook location required by MIL-STD-883E standard, whereas location B was located near to the second bond. The correlation between new purposed failure modes and MIL-STD-883E standard was developed to reflect on the pull strength with the physical failure. Findings– It was observed that fine pitch Au wire has higher variation and lower process capability of pull strength. Au wire pulled by the hook at location B provides a more representative result compared to that at location A. Fifty per cent or more of Au remnant is required to be considered as a good and reliable Au wedge bond based on the new purposed failure modes. Originality/value– The evaluation of gold (Au) wedge bond requires a new proper wire pulling test method. This is due to the large variation obtained from the application of current practice of wire pulling test. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Effect of wire diameter and hook location on second bond failure modes

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References (15)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/MI-03-2014-0011
Publisher site
See Article on Publisher Site

Abstract

Purpose– This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify the variation of results obtained. Design/methodology/approach– Two hook locations, namely, location A and location B were used to analyze the effect of hook location. Location A was the same as the hook location required by MIL-STD-883E standard, whereas location B was located near to the second bond. The correlation between new purposed failure modes and MIL-STD-883E standard was developed to reflect on the pull strength with the physical failure. Findings– It was observed that fine pitch Au wire has higher variation and lower process capability of pull strength. Au wire pulled by the hook at location B provides a more representative result compared to that at location A. Fifty per cent or more of Au remnant is required to be considered as a good and reliable Au wedge bond based on the new purposed failure modes. Originality/value– The evaluation of gold (Au) wedge bond requires a new proper wire pulling test method. This is due to the large variation obtained from the application of current practice of wire pulling test.

Journal

Microelectronics International – Emerald Publishing

Published: Jan 5, 2015

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