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- Publisher
- Emerald Publishing
- Copyright
- Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
- ISSN
- 0954-0911
- DOI
- 10.1108/09540910810902651
- Publisher site
- See Article on Publisher Site
Abstract
Purpose – The purpose of this paper is to examine the microstructure and evaluate the intermetallic compounds in the following lead‐free solder alloys: Sn 98.5 Ag 1.0 Cu 0.5 (SAC105) Sn 97.5 Ag 2.0 Cu 0.5 (SAC205) Sn 96.5 Ag 3.0 Cu 0.5 (SAC305) and Sn 95.5 Ag 4.0 Cu 0.5 (SAC405). Design/methodology/approach – X‐ray diffraction (XRD) and scanning electron microscopy (SEM) were employed to identify the main intermetallics formed during solidification. Differential scanning calorimetry (DSC) was used to investigate the undercooling properties of each of the alloys. Findings – By using XRD analysis in addition to energy dispersive spectroscopy (EDS) it was found that the main intermetallics were Cu 6 Sn 5 and Ag 3 Sn in a Sn matrix. Plate‐like ϵ‐Ag 3 Sn intermetallics were observed for all four alloys. Solder alloys SAC105, SAC205 and SAC305 showed a similar microstructure, while SAC405 displayed a fine microstructure with intermetallic phases dense within the Sn matrix. Originality/value – Currently, low‐silver content SAC alloys are being investigated due to their lower cost, however, the overall reliability of an alloy can be greatly affected by the microstructure and this should be taken into consideration when choosing an alloy. The size and number of Ag 3 Sn plate‐like intermetallics can affect the reliability as they act as a site for crack propagation.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Sep 19, 2008
Keywords: Solder; Alloys; Reliability management