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H. Berg, E.L. Hall
Dissolution rate and reliability effects of gold, silver, nickel and copper in lead base solders
- Publisher
- Emerald Publishing
- Copyright
- Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
- ISSN
- 0954-0911
- DOI
- 10.1108/09540910410562473
- Publisher site
- See Article on Publisher Site
Abstract
The dissolution rates of iron and alloyed steels in molten lead‐free solders were investigated in order to clarify the effect of erosion of iron plating on soldering iron tips. The dissolution rates of iron‐based alloys in lead‐free solders were found to be about three times greater than in conventional Sn‐Pb eutectics, indicating that the iron plating of a soldering iron tip is subjected to heavier damage when used with lead‐free rather than eutectic Sn‐Pb. Several steel alloys showed dissolution rates similar to that of pure iron, suggesting that compositional changes in the iron plating may have little influence on the erosion depth. Decreases in the reaction temperature and time, and a small addition of iron into the solder was found to be effective in suppressing both dissolution of iron wire and erosion of iron plating.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Dec 1, 2004
Keywords: Solders; Soldering; Surface treatment