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Designing Electronics for Automated Inspection

Designing Electronics for Automated Inspection Electronic packaging technologies, such as pin grid arrays, increasingly small pitch surface mount, and doublesided assemblies are all aimed towards the highest possible product density, with improved performance. The gap between inspection effectiveness and advances made in packaging technologies is becoming larger. As efforts proceed, to learn more about critical factors influencing reliability of solder joints, it is prudent to ensure that printed wiring assembly PWA design rules evolve to permit the broadest range of anticipated automated inspection requirements. The range of automated inspection technologies can all be made more effective through careful design of electronics for inspection. Significant opportunities lie in both PWA layout and design, as well as electronic component design, tolerancing, and standardisation. Many inspection issues are shared, but with increased recognition of digital radiography's unique capabilities this discussion will emphasise Xray inspection issues. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Designing Electronics for Automated Inspection

Circuit World , Volume 14 (4): 8 – Mar 1, 1988

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046032
Publisher site
See Article on Publisher Site

Abstract

Electronic packaging technologies, such as pin grid arrays, increasingly small pitch surface mount, and doublesided assemblies are all aimed towards the highest possible product density, with improved performance. The gap between inspection effectiveness and advances made in packaging technologies is becoming larger. As efforts proceed, to learn more about critical factors influencing reliability of solder joints, it is prudent to ensure that printed wiring assembly PWA design rules evolve to permit the broadest range of anticipated automated inspection requirements. The range of automated inspection technologies can all be made more effective through careful design of electronics for inspection. Significant opportunities lie in both PWA layout and design, as well as electronic component design, tolerancing, and standardisation. Many inspection issues are shared, but with increased recognition of digital radiography's unique capabilities this discussion will emphasise Xray inspection issues.

Journal

Circuit WorldEmerald Publishing

Published: Mar 1, 1988

There are no references for this article.