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Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free... Purpose – The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high‐density packages on printed circuit boards using a low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag). Design/methodology/approach – The components studied include several SMT package types and various lead configurations. The assembly process addresses the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages. Findings – It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent. Originality/value – The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi‐42Sn‐1Ag alloy, which has a melting point of 139°C. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

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Publisher
Emerald Publishing
Copyright
Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910810871520
Publisher site
See Article on Publisher Site

Abstract

Purpose – The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high‐density packages on printed circuit boards using a low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag). Design/methodology/approach – The components studied include several SMT package types and various lead configurations. The assembly process addresses the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages. Findings – It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent. Originality/value – The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi‐42Sn‐1Ag alloy, which has a melting point of 139°C.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Apr 11, 2008

Keywords: Solder; Lead; Low temperatures; Density; Packaging processes

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