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/lp/emerald-publishing/design-materials-and-assembly-process-of-high-density-packages-with-a-08nTTGboja
- Publisher
- Emerald Publishing
- Copyright
- Copyright © 2008 Emerald Group Publishing Limited. All rights reserved.
- ISSN
- 0954-0911
- DOI
- 10.1108/09540910810871520
- Publisher site
- See Article on Publisher Site
Abstract
Purpose – The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high‐density packages on printed circuit boards using a low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag). Design/methodology/approach – The components studied include several SMT package types and various lead configurations. The assembly process addresses the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages. Findings – It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent. Originality/value – The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi‐42Sn‐1Ag alloy, which has a melting point of 139°C.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Apr 11, 2008
Keywords: Solder; Lead; Low temperatures; Density; Packaging processes