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Design for lead‐free solder joint reliability of high‐density packages

Design for lead‐free solder joint reliability of high‐density packages The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256‐pin plastic ball grid array (PBGA), a 388‐pin PBGA, and a 1657‐pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead‐free solder joints of these packages. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Design for lead‐free solder joint reliability of high‐density packages

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References (10)

Publisher
Emerald Publishing
Copyright
Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
ISSN
0954-0911
DOI
10.1108/09540910410517013
Publisher site
See Article on Publisher Site

Abstract

The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256‐pin plastic ball grid array (PBGA), a 388‐pin PBGA, and a 1657‐pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead‐free solder joints of these packages.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Apr 1, 2004

Keywords: Solder; Soldering; Tin‐lead; Design for quality; Printed‐circuit boards; Finite element analysis

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