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Cure behavior of a no flow underfill encapsulant

Cure behavior of a no flow underfill encapsulant The curing reaction of a promising no flow flip chip underfill encapsulant is investigated by using a differential scanning calorimeter. It is found that the tested underfill can reach complete cure within 20 minutes at various cure temperatures. It is also shown that this no flow underfill could fully cure within one minute at 160C after being heated at 220C for one minute, demonstrating that this no flow underfill can be completely cured during the solder reflow cycle. The reaction order and the rate constant are determined to describe the curing progress. It is shown that the autocatalytic effect dominates the reaction kinetics. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Cure behavior of a no flow underfill encapsulant

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360010305949
Publisher site
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Abstract

The curing reaction of a promising no flow flip chip underfill encapsulant is investigated by using a differential scanning calorimeter. It is found that the tested underfill can reach complete cure within 20 minutes at various cure temperatures. It is also shown that this no flow underfill could fully cure within one minute at 160C after being heated at 220C for one minute, demonstrating that this no flow underfill can be completely cured during the solder reflow cycle. The reaction order and the rate constant are determined to describe the curing progress. It is shown that the autocatalytic effect dominates the reaction kinetics.

Journal

Microelectronics International – Emerald Publishing

Published: Apr 1, 2000

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