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Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC PurposeThis paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC).Design/methodology/approachThis paper includes experiments and finite element simulation.FindingsThe growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 μm/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC.Originality/valueThe Cu/SnAgCu/CuTLPbondingwithdifferentthicknessesfor3D IC was investigated. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/SSMT-07-2016-0015
Publisher site
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Abstract

PurposeThis paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC).Design/methodology/approachThis paper includes experiments and finite element simulation.FindingsThe growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 μm/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC.Originality/valueThe Cu/SnAgCu/CuTLPbondingwithdifferentthicknessesfor3D IC was investigated.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: Jun 5, 2017

References

  • Retarding the Cu-Sn and Ag-Sn intermetallic compounds by applying Cu-xZn alloy on micro-bump in novel 3D-IC technologies
  • Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill
  • Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections
  • Effects of bonding parameters on the reliability of fine-pitch Cu/Ni/SnAg micro-bump chip-to-chip interconnection for three-dimensional chip stacking
  • 3D chip stacking with 50μm pitch lead-free micro-C4 interconnections
  • Low-resistance Cu-Sn electroplated-evaporated microbumps for 3D chip stacking
  • Thermo-mechanical analysis of TSV and solder interconnects for different Cu pillar bump types
  • Volume effect on shear strength of SnAgCu lead-free solder joints
  • Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface
  • Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging
  • Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint application
  • Size and volume effects on the strength of microscale lead-free solder joints
  • Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D IC