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References (4)
-
R.M. Horsley, N.N. Ekere
Causes of voiding in plastic ball grid array eutectic solder joints -
A. Chen, I. Sterian, P. Arrowsmith, T. Sack, G. Baragetti
Integrate CSP into main stream SMT assembly process -
R.S. Clouthier
SMT printing process for fine and ultra fine pitch -
I. Sterian, A. Chen, C. Quan, R. Mohabir, J. Bragg, K. Chang
Compatibility of CSPs in SMT assembly
- Publisher
- Emerald Publishing
- Copyright
- Copyright © 1999 MCB UP Ltd. All rights reserved.
- ISSN
- 0954-0911
- DOI
- 10.1108/09540919910265659
- Publisher site
- See Article on Publisher Site
Abstract
To achieve integration of chip scale package (CSP) devices into main stream surface mount technology (SMT) assembly, various experiments have been required. In process development, experiences learned from flip chip attach and ball grid array (BGA) assembly were utilized. Key process parameters for CSP assembly were defined and some of those key factors were optimized. They will be presented in this paper. Some observations during prototype build have been documented for correlation with reliability results in the future. The requirements for further CSP assembly studies will also be addressed in this paper.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Aug 1, 1999
Keywords: Assembly; Ball grid array; Chipscale packaging; Microvias; Surface mount technology