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Critical issues, processes and solutions in ISFET packaging

Critical issues, processes and solutions in ISFET packaging Purpose To provide an insight of the intricacies of ionsensitive fieldeffect transistor ISFET encapsulation and describe the presently available packaging solutions, indicating how the packaging requirements can be complied for various applications.Designmethodologyapproach ISFET packaging is a complete subject in itself. The paper includes examples of the different packaging strategies that have been offered by literature and company findings over the past few decades.Findings ISFET packaging has progressed from the initial epoxy embedding of the wire bonds and contact pads to the more sophisticated techniques capable of automation wherein moulds are made for epoxy coating or the chip is tightened between contacting parts using elastomer gaskets.Research limitationsimplications The emerging packaging technologies have succeeded in making chip packaging more a science than an art, and the new methods are capable of largescale manufacturing with greater precision.Practical implications Packaging solutions for demanding applications of ISFETs have been provided by the upcoming technologies.Originalityvalue The information provided in this paper is of immense value to researchers working on ISFET encapsulation. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Critical issues, processes and solutions in ISFET packaging

Microelectronics International , Volume 25 (2): 8 – Apr 18, 2008

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360810875976
Publisher site
See Article on Publisher Site

Abstract

Purpose To provide an insight of the intricacies of ionsensitive fieldeffect transistor ISFET encapsulation and describe the presently available packaging solutions, indicating how the packaging requirements can be complied for various applications.Designmethodologyapproach ISFET packaging is a complete subject in itself. The paper includes examples of the different packaging strategies that have been offered by literature and company findings over the past few decades.Findings ISFET packaging has progressed from the initial epoxy embedding of the wire bonds and contact pads to the more sophisticated techniques capable of automation wherein moulds are made for epoxy coating or the chip is tightened between contacting parts using elastomer gaskets.Research limitationsimplications The emerging packaging technologies have succeeded in making chip packaging more a science than an art, and the new methods are capable of largescale manufacturing with greater precision.Practical implications Packaging solutions for demanding applications of ISFETs have been provided by the upcoming technologies.Originalityvalue The information provided in this paper is of immense value to researchers working on ISFET encapsulation.

Journal

Microelectronics InternationalEmerald Publishing

Published: Apr 18, 2008

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