Creation and verification of dynamic compact thermal model of a BGA package

Creation and verification of dynamic compact thermal model of a BGA package Purpose The purpose of this paper is to develop a dynamic compact thermal model DCTM of electronic packages. This model is a necessary tool for rapid thermal analysis of the systems which we exposed to boundary condition variation andor power switching mode such as mobile systems and battery powered systems.Designmethodologyapproach The methodology of compact model generation used was based on generating the transient dynamic detailed finite element thermal model of a package, designing a resistorcapacitor network topology representative of the dynamic detailed model, calculating the resistors'capacitors' value by optimization method and validation efforts. The method is demonstrated for a ball grid array BGA package, a commonly used modern electronic package.Findings Based on the obtained results, it can be concluded that the dynamic thermal behavior of a BGA package can be accurately described by a generated dynamic compact model in terms of predicted junction temperature response and heat flux of the desired locations of the package.Originalityvalue This model is capable of calculating the temperatures and heat fluxes at desired locations which can help the designer to perform the thermal analysis much faster and easier with the required accuracy. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Creation and verification of dynamic compact thermal model of a BGA package

Microelectronics International, Volume 25 (3): 11 – Jul 25, 2008

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/13565360810889566
Publisher site
See Article on Publisher Site

Abstract

Purpose The purpose of this paper is to develop a dynamic compact thermal model DCTM of electronic packages. This model is a necessary tool for rapid thermal analysis of the systems which we exposed to boundary condition variation andor power switching mode such as mobile systems and battery powered systems.Designmethodologyapproach The methodology of compact model generation used was based on generating the transient dynamic detailed finite element thermal model of a package, designing a resistorcapacitor network topology representative of the dynamic detailed model, calculating the resistors'capacitors' value by optimization method and validation efforts. The method is demonstrated for a ball grid array BGA package, a commonly used modern electronic package.Findings Based on the obtained results, it can be concluded that the dynamic thermal behavior of a BGA package can be accurately described by a generated dynamic compact model in terms of predicted junction temperature response and heat flux of the desired locations of the package.Originalityvalue This model is capable of calculating the temperatures and heat fluxes at desired locations which can help the designer to perform the thermal analysis much faster and easier with the required accuracy.

Journal

Microelectronics InternationalEmerald Publishing

Published: Jul 25, 2008

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