Access the full text.
Sign up today, get DeepDyve free for 14 days.
Loading next page...
/lp/emerald-publishing/creation-and-verification-of-dynamic-compact-thermal-model-of-a-bga-MZBQ40vM20
References (11)
-
S. Attar, M. Yagoub, F. Mohammadi (2006)
New Electro-Thermal Integrated Circuit Modeling using Coupling of Simulators2006 Canadian Conference on Electrical and Computer Engineering
-
C. Lasance (2001)
Two benchmarks to facilitate the study of compact thermal modeling phenomenaIEEE Transactions on Components and Packaging Technologies, 24
-
V. Arpaci, A. Salamet, S. Kao, Y. Jaluria (1950)
An Introduction to Heat Transfer -
A. Aranyosi, A. Ortega, R. Griffin, S. West, D. Edwards (2000)
Compact thermal models of packages used in conduction cooled applicationsIEEE Transactions on Components and Packaging Technologies, 23
-
10.1109/95.650928
-
C. Gillot, Y. Avenas, N. Cezac, G. Poupon, C. Schaeffer, E. Fournier (2002)
Silicon heat pipes used as thermal spreadersITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)
-
10.1109/TCAPT.2003.815092
-
D. Celo, Xiaoming Guo, P. Gunupudi, R. Khazaka, D. Walkey, T. Smy, M. Nakhla (2005)
The creation of compact thermal models of electronic components using model reductionIEEE Transactions on Advanced Packaging, 28
-
F. Mohammadi, K. Meres, M. Yagoub (2005)
Rigorous thermal treatment of heat generation and heat transfer in GaAs-based HBT device modelingEuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.
-
H. Rosten, C. Lasance, J. Parry (1997)
The world of thermal characterization according to DELPHI-Part I: Background to DELPHIIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 20
-
J. Nelder, R. Mead (1965)
A Simplex Method for Function MinimizationComput. J., 7
- Publisher
- Emerald Publishing
- Copyright
- Copyright © Emerald Group Publishing Limited
- ISSN
- 1356-5362
- DOI
- 10.1108/13565360810889566
- Publisher site
- See Article on Publisher Site
Abstract
Purpose The purpose of this paper is to develop a dynamic compact thermal model DCTM of electronic packages. This model is a necessary tool for rapid thermal analysis of the systems which we exposed to boundary condition variation andor power switching mode such as mobile systems and battery powered systems.Designmethodologyapproach The methodology of compact model generation used was based on generating the transient dynamic detailed finite element thermal model of a package, designing a resistorcapacitor network topology representative of the dynamic detailed model, calculating the resistors'capacitors' value by optimization method and validation efforts. The method is demonstrated for a ball grid array BGA package, a commonly used modern electronic package.Findings Based on the obtained results, it can be concluded that the dynamic thermal behavior of a BGA package can be accurately described by a generated dynamic compact model in terms of predicted junction temperature response and heat flux of the desired locations of the package.Originalityvalue This model is capable of calculating the temperatures and heat fluxes at desired locations which can help the designer to perform the thermal analysis much faster and easier with the required accuracy.
Journal
Microelectronics International – Emerald Publishing
Published: Jul 25, 2008