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Correlation of Chemical Microstructure with Solderability of PCBs

Correlation of Chemical Microstructure with Solderability of PCBs A combination of analytical methods was used on printed circuit board coupons to conclude the following 1 while steam ageing deteriorates solderability of tinned coupons, it does not increase the oxide thickness or tinlead ratio of the surface top 50 Angstroms of tinned coupons 2 therefore, some other factor, probably oxidation of the copper or tincopper intermetallic substrate, determines solderability of the coupons. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Circuit World Emerald Publishing

Correlation of Chemical Microstructure with Solderability of PCBs

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0305-6120
DOI
10.1108/eb046150
Publisher site
See Article on Publisher Site

Abstract

A combination of analytical methods was used on printed circuit board coupons to conclude the following 1 while steam ageing deteriorates solderability of tinned coupons, it does not increase the oxide thickness or tinlead ratio of the surface top 50 Angstroms of tinned coupons 2 therefore, some other factor, probably oxidation of the copper or tincopper intermetallic substrate, determines solderability of the coupons.

Journal

Circuit World – Emerald Publishing

Published: Apr 1, 1991

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