Copper Ballwedge Bonding and Its Problems

Copper Ballwedge Bonding and Its Problems An evaluation of the feasibility of copper ballwedge bonding on Au, Cu thick film and aluminium metallisations was carried out. This evaluation is not merely a check for feasibility, but will also give more insight into the problems concerning copper ballwedge bonding. This article does not pretend to represent profound research on copper ball bonding, but will give qualitative insight. Copper ball bonding, without using cover gas, is possible, but the bond quality decreases. Extrusion and penetration of the ball bond in the substrates are caused by the hardness of the copper. This can only be avoided when the hardness of the substrate is matched to the hardness of the copper ballwire. Bonding mechanisms are similar for bonding on thick film to those for bonding on metallisations. Matching hardness of the substrate to the ballwire seems to be a necessity for proper ballwedge bonding. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International Emerald Publishing

Copper Ballwedge Bonding and Its Problems

Microelectronics International, Volume 5 (2): 5 – Feb 1, 1988

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
1356-5362
DOI
10.1108/eb044325
Publisher site
See Article on Publisher Site

Abstract

An evaluation of the feasibility of copper ballwedge bonding on Au, Cu thick film and aluminium metallisations was carried out. This evaluation is not merely a check for feasibility, but will also give more insight into the problems concerning copper ballwedge bonding. This article does not pretend to represent profound research on copper ball bonding, but will give qualitative insight. Copper ball bonding, without using cover gas, is possible, but the bond quality decreases. Extrusion and penetration of the ball bond in the substrates are caused by the hardness of the copper. This can only be avoided when the hardness of the substrate is matched to the hardness of the copper ballwire. Bonding mechanisms are similar for bonding on thick film to those for bonding on metallisations. Matching hardness of the substrate to the ballwire seems to be a necessity for proper ballwedge bonding.

Journal

Microelectronics InternationalEmerald Publishing

Published: Feb 1, 1988

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