Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Cooling Problems Facing the Electronics and Aerospace Industries

Cooling Problems Facing the Electronics and Aerospace Industries Heat is generated in electronics and other electrical systems by resistive heating, hysteresis losses, eddy currents, and switching activities. The faster a microchip performs, the greater the rate of heat generation, and the smaller the chip, the greater the rate of heat flux generated. Thus, as electronics technologies advance, thermal systems designers are presented with even more complex problems as to how to extract heat from microelectronics, printedcircuit boards, electronics racks, thyristor assemblies, transformers, rotating electrical machinery, space vehicles, aerospace structures and control systems. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Aircraft Engineering and Aerospace Technology Emerald Publishing

Cooling Problems Facing the Electronics and Aerospace Industries

Loading next page...
 
/lp/emerald-publishing/cooling-problems-facing-the-electronics-and-aerospace-industries-a1E4aOXAYR

References (1)

Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0002-2667
DOI
10.1108/eb036968
Publisher site
See Article on Publisher Site

Abstract

Heat is generated in electronics and other electrical systems by resistive heating, hysteresis losses, eddy currents, and switching activities. The faster a microchip performs, the greater the rate of heat generation, and the smaller the chip, the greater the rate of heat flux generated. Thus, as electronics technologies advance, thermal systems designers are presented with even more complex problems as to how to extract heat from microelectronics, printedcircuit boards, electronics racks, thyristor assemblies, transformers, rotating electrical machinery, space vehicles, aerospace structures and control systems.

Journal

Aircraft Engineering and Aerospace TechnologyEmerald Publishing

Published: Jul 1, 1990

There are no references for this article.