Convection vs vapour phase reflow in LED and BGA assembly

Convection vs vapour phase reflow in LED and BGA assembly PurposeThe aim of this paper is to evaluate using statistical methods how two soldering techniques – the convection reflow and vapour phase reflow with vacuum – influence reduction of voids in lead-free solder joints under Light Emitted Diodes (LEDs) and Ball Grid Arrays (BGAs).Design/methodology/approachDistribution of voids in solder joints under thermal and electrical pads of LEDs and in solder balls of BGAs assembled with convection reflow and vapour phase reflow with vacuum has been investigated in terms of coverage or void contents, void diameters and number of voids. For each soldering technology, 80 LEDs and 32 solder balls in BGAs were examined. Soldering processes were carried out in the industrial or semi-industrial environment. The OM340 solder paste of Innolot type was used for LED soldering. Voidings in solder joints were inspected with a 2D X-ray transmission system. OriginLab was used for statistical analysis.FindingsInvestigations supported by statistical analysis showed that the vapour phase reflow with vacuum decreases significantly void contents and number and diameters of voids in solder joints under LED and BGA packages when compared to convection reflow.Originality/valueVoiding distribution data were collected on the basis of 2D X-ray images for test samples manufactured during the mass production processes. Statistical analysis enabled to appraise soldering technologies used in these processes in respect of void formation. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Convection vs vapour phase reflow in LED and BGA assembly

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Publisher
Emerald Publishing
Copyright
Copyright © Emerald Group Publishing Limited
ISSN
0954-0911
DOI
10.1108/SSMT-10-2017-0031
Publisher site
See Article on Publisher Site

Abstract

PurposeThe aim of this paper is to evaluate using statistical methods how two soldering techniques – the convection reflow and vapour phase reflow with vacuum – influence reduction of voids in lead-free solder joints under Light Emitted Diodes (LEDs) and Ball Grid Arrays (BGAs).Design/methodology/approachDistribution of voids in solder joints under thermal and electrical pads of LEDs and in solder balls of BGAs assembled with convection reflow and vapour phase reflow with vacuum has been investigated in terms of coverage or void contents, void diameters and number of voids. For each soldering technology, 80 LEDs and 32 solder balls in BGAs were examined. Soldering processes were carried out in the industrial or semi-industrial environment. The OM340 solder paste of Innolot type was used for LED soldering. Voidings in solder joints were inspected with a 2D X-ray transmission system. OriginLab was used for statistical analysis.FindingsInvestigations supported by statistical analysis showed that the vapour phase reflow with vacuum decreases significantly void contents and number and diameters of voids in solder joints under LED and BGA packages when compared to convection reflow.Originality/valueVoiding distribution data were collected on the basis of 2D X-ray images for test samples manufactured during the mass production processes. Statistical analysis enabled to appraise soldering technologies used in these processes in respect of void formation.

Journal

Soldering & Surface Mount TechnologyEmerald Publishing

Published: Apr 3, 2018

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