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Cleaning control of stencil printing subject to performance deterioration

Cleaning control of stencil printing subject to performance deterioration Most solder paste printers are configured to periodically clean the stencil to maintain printing quality. However, a periodical cleaning control may result in excessive cleaning operations. The purpose of this paper is to develop a control method to schedule stencil cleaning operations appropriately.Design/methodology/approachA hybrid failure rate model of the stencil printing process with age reduction factor and failure rate increase factor is presented. A stencil cleaning policy based on system reliability is introduced. An optimization model used to derive the optimal stencil cleaning schedule is provided.FindingsAn aperiodic stencil cleaning control with good adaptability is achieved. A comparative analysis indicates that aperiodic control has better printing system reliability than traditional periodical control under the same cleaning resource consumption.Originality/valuePeriodical cleaning control commonly used in industrial printing process often results in excessive cleaning operations. By incorporating the printing system reliability, this paper develops an aperiodic stencil cleaning control method based on hybrid failure rate model of the stencil printing process. It helps to reduce unnecessary cleaning operations while keeping printing quality stable. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Soldering & Surface Mount Technology Emerald Publishing

Cleaning control of stencil printing subject to performance deterioration

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References (24)

Publisher
Emerald Publishing
Copyright
© Emerald Publishing Limited
ISSN
0954-0911
DOI
10.1108/ssmt-12-2019-0043
Publisher site
See Article on Publisher Site

Abstract

Most solder paste printers are configured to periodically clean the stencil to maintain printing quality. However, a periodical cleaning control may result in excessive cleaning operations. The purpose of this paper is to develop a control method to schedule stencil cleaning operations appropriately.Design/methodology/approachA hybrid failure rate model of the stencil printing process with age reduction factor and failure rate increase factor is presented. A stencil cleaning policy based on system reliability is introduced. An optimization model used to derive the optimal stencil cleaning schedule is provided.FindingsAn aperiodic stencil cleaning control with good adaptability is achieved. A comparative analysis indicates that aperiodic control has better printing system reliability than traditional periodical control under the same cleaning resource consumption.Originality/valuePeriodical cleaning control commonly used in industrial printing process often results in excessive cleaning operations. By incorporating the printing system reliability, this paper develops an aperiodic stencil cleaning control method based on hybrid failure rate model of the stencil printing process. It helps to reduce unnecessary cleaning operations while keeping printing quality stable.

Journal

Soldering & Surface Mount Technology – Emerald Publishing

Published: May 17, 2021

Keywords: Optimization model; System reliability; Aperiodic stencil cleaning; Cleaning control

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